LFCPNX-100-8BBG484A

IC FPGA CERTUSPRO-NX Q100 484BGA
Part Description

CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 484-LFBGA

Quantity 1,046 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-CABGA (19x19)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-LFBGANumber of I/O313Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24000Number of Logic Elements/Cells96000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits3833856

Overview of LFCPNX-100-8BBG484A – CertusPro™-NX Field Programmable Gate Array (FPGA), 484-LFBGA

The LFCPNX-100-8BBG484A is a CertusPro™-NX field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a large logic fabric with extensive embedded memory and I/O resources in a compact 484-LFBGA package, targeted for designs requiring high integration and automotive qualification.

Key capabilities include 96,000 logic elements, approximately 3.83 Mbits of on-chip RAM, 313 I/Os, AEC‑Q100 qualification, and an operating range spanning −40 °C to 125 °C with a core supply range of 0.95 V to 1.05 V.

Key Features

  • Core Logic 96,000 logic elements provide a large programmable fabric for complex combinational and sequential logic implementations.
  • Embedded Memory Approximately 3.83 Mbits of on-chip RAM to support buffering, state storage, and data-intensive functions without external memory.
  • I/O Density 313 I/O pins enable extensive peripheral connectivity and flexible interface mapping for multi-channel designs.
  • Package & Mounting 484-LFBGA (supplier package: 484-CABGA, 19×19) in a surface-mount form factor for board-level integration where high pin count and compact footprint are required.
  • Power Core supply range of 0.95 V to 1.05 V to match system power rails and enable predictable power budgeting.
  • Temperature & Qualification Automotive grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for use in temperature-demanding environments.
  • Regulatory Compliance RoHS compliant for adherence to common material and environmental requirements.

Typical Applications

  • Automotive Systems — AEC‑Q100 qualification and a −40 °C to 125 °C operating range make this FPGA suitable for in-vehicle processing, control logic, and sensor interface tasks.
  • High-density Embedded Designs — Large logic count and substantial on-chip RAM support complex control, signal processing, and protocol handling within a single device.
  • Multi-interface Controllers — With 313 I/Os, the device is well suited for designs that require numerous peripheral connections and flexible I/O routing.

Unique Advantages

  • Large Programmable Fabric: 96,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
  • Significant On-chip Memory: Approximately 3.83 Mbits of embedded RAM minimizes dependence on external memory for temporary storage and buffering.
  • Automotive Qualification: AEC‑Q100 qualification and wide operating temperature enable deployment in vehicle-grade applications where reliability matters.
  • High I/O Capacity: 313 I/Os provide flexibility to interface with a variety of sensors, actuators, and external devices without multiplexing compromises.
  • Compact, High-pin Package: 484-LFBGA (19×19) delivers high pin count in a compact footprint suitable for space-constrained PCBs.
  • Low-voltage Core Operation: Core supply range of 0.95 V to 1.05 V supports modern low-voltage system designs and predictable power planning.

Why Choose LFCPNX-100-8BBG484A?

The LFCPNX-100-8BBG484A positions itself as a highly integrated FPGA option for designs that require substantial logic capacity, embedded memory, and a large number of I/Os in a compact automotive-qualified package. Its combination of 96,000 logic elements, approximately 3.83 Mbits of RAM, and 313 I/Os supports consolidation of complex functions while meeting automotive temperature and qualification requirements.

This device is appropriate for engineering teams developing automotive and other temperature-demanding embedded systems that need a robust, high-density programmable solution with predictable supply and packaging characteristics.

Request a quote or submit an inquiry to receive pricing and availability information for LFCPNX-100-8BBG484A and to discuss how it fits your design requirements.

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