LFCPNX-100-8BFG484I

IC FPGA CERTUSPRO-NX 484BGA
Part Description

CertusPro™-NX Field Programmable Gate Array (FPGA) IC 309 3833856 96000 484-BBGA

Quantity 1,593 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O309Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24000Number of Logic Elements/Cells96000
Number of GatesN/AECCNN/AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFCPNX-100-8BFG484I – CertusPro™-NX Field Programmable Gate Array, 484-BBGA

The LFCPNX-100-8BFG484I is a CertusPro™-NX field programmable gate array (FPGA) from Lattice Semiconductor Corporation, provided in a 484-ball BGA package. It delivers a high density of programmable logic and I/O suitable for industrial-grade embedded applications.

Key attributes include 96,000 logic elements, approximately 3.83 Mbits of embedded memory, 309 I/Os, and operation across a wide industrial temperature range, offering integration and configurability for complex digital systems.

Key Features

  • Core Logic  96,000 logic elements available for implementing custom digital functions and hardware accelerators.
  • Embedded Memory  Approximately 3.83 Mbits (3,833,856 bits) of on-chip RAM to support buffering, lookup tables, and state storage.
  • I/O Density  309 user I/Os to interface with peripherals, sensors, transceivers and external logic.
  • Power Supply  Core voltage supply range of 0.95 V to 1.05 V to match system power rails and design constraints.
  • Package and Mounting  484-ball BGA package (supplier device package: 484-FPBGA, 23×23); surface-mount mounting type for PCB assembly.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet requirements for industrial environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Industrial Automation  Use the FPGA’s logic density and industrial temperature rating to implement control logic, sensor aggregation, and real-time processing in factory automation systems.
  • Embedded System Integration  Deploy programmable interfaces and custom peripherals using the device’s 309 I/Os and embedded memory for compact embedded platforms.
  • Communications and I/O Bridging  Leverage the ample I/O count and on-chip RAM to implement protocol bridging, I/O aggregation, and data buffering tasks in communications subsystems.

Unique Advantages

  • High logic capacity: 96,000 logic elements enable complex designs and multiple concurrent hardware functions on a single device, reducing board-level component count.
  • Significant on-chip memory: Approximately 3.83 Mbits of embedded RAM supports data buffering and stateful processing without immediate dependence on external memory.
  • Large I/O count: 309 I/Os provide flexible connectivity options for peripherals, sensors, and interface standards, simplifying system integration.
  • Industrial-rated operation: Specified −40 °C to 100 °C operating temperature range for deployment in industrial environments and systems.
  • Compact BGA package: 484-BBGA (484-FPBGA, 23×23) offers a high-density footprint suitable for space-constrained PCBs with surface-mount assembly.
  • Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose LFCPNX-100-8BFG484I?

The LFCPNX-100-8BFG484I positions itself as a versatile, industrial-grade FPGA offering substantial logic resources, embedded memory, and a high I/O count in a compact 484-BBGA package. Its specified voltage and temperature ranges make it suitable for robust embedded and industrial designs that demand configurable hardware and reliable operation.

This device is well suited for engineering teams seeking a programmable, high-density logic platform that reduces external component count while supporting a broad array of interfaces and on-chip memory requirements for scalable designs.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and lead-time information for the LFCPNX-100-8BFG484I.

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