LFCPNX-100-8LFG672C
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 672-BBGA |
|---|---|
| Quantity | 778 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 313 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 24000 | Number of Logic Elements/Cells | 96000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFCPNX-100-8LFG672C – CertusPro™-NX Field Programmable Gate Array (FPGA), 672‑BBGA
The LFCPNX-100-8LFG672C is a CertusPro™-NX Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, delivered in a high pin‑count 672‑BBGA package. It provides substantial logic capacity and on‑chip RAM in a compact surface‑mount package for commercial applications.
With 96,000 logic elements, approximately 3.8 Mbits of embedded memory and 313 user I/O, this device targets commercial designs that require high logic density, flexible I/O and low‑voltage core operation (0.95–1.05 V).
Key Features
- Logic Capacity — 96,000 logic elements and 24,000 CLBs provide large-scale programmable fabric for complex logic integration.
- Embedded Memory — Approximately 3.8 Mbits (3,833,856 bits) of on‑chip RAM for buffering, FIFOs and data storage without external memory.
- I/O Resources — 313 user I/O pins to support broad interfacing requirements and multiple peripheral connections.
- Low‑Voltage Core — Core voltage supply range of 0.95 V to 1.05 V to match low‑voltage system domains.
- Package & Mounting — 672‑BBGA package, supplier device package 672‑FCBGA (27×27), surface mount for high‑density board designs.
- Operating Range & Grade — Commercial grade device with operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- High integration density: Large logic element count and substantial on‑chip RAM reduce the need for external components and simplify BOM.
- Flexible interfacing: 313 user I/O enable a wide variety of signal routing and peripheral connections without external multiplexing.
- Space‑efficient packaging: 672‑BBGA / 672‑FCBGA (27×27) provides a high pin count in a compact footprint for constrained PCBs.
- Power‑aligned core operation: Narrow 0.95–1.05 V supply range supports integration into low‑voltage system architectures.
- Commercial temperature rating: Designed for commercial applications with an operating range of 0 °C to 85 °C.
- Manufacturer backing: Supplied by Lattice Semiconductor Corporation, providing standard industry support and product availability for commercial designs.
Why Choose LFCPNX-100-8LFG672C?
The LFCPNX-100-8LFG672C positions itself as a high‑capacity, commercially graded FPGA solution that balances logic density, embedded memory and extensive I/O in a compact BGA package. Its combination of 96,000 logic elements, approximately 3.8 Mbits of on‑chip RAM and 313 I/O pins makes it suitable for commercial designs that require significant on‑chip resources while maintaining a small PCB footprint.
Engineers and procurement teams seeking a commercially rated FPGA from Lattice Semiconductor Corporation can rely on this device for designs that demand high integration, low‑voltage core operation and RoHS compliance. The package and electrical specifications support scalable implementation across a range of commercial applications.
Request a quote or submit an inquiry to receive pricing and availability information for the LFCPNX-100-8LFG672C.

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