LFCPNX-100-9ASG256I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 169 3833856 96000 256-LBGA |
|---|---|
| Quantity | 91 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-SBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 169 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24000 | Number of Logic Elements/Cells | 96000 | ||
| Number of Gates | N/A | ECCN | 5A992C 24 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFCPNX-100-9ASG256I – CertusPro™-NX FPGA, 96,000 logic elements, 169 I/O, 256-LBGA
The LFCPNX-100-9ASG256I is a CertusPro™-NX field programmable gate array (FPGA) IC offering substantial programmable logic capacity and embedded memory in a compact BGA package. Designed for industrial-grade environments, it provides a combination of high logic density, significant on-chip memory, and a generous I/O complement.
This device supports low-voltage core operation and extended temperature ranges, making it suitable for mid-to-high density FPGA designs that require reliable operation across a wide set of industrial conditions.
Key Features
- Logic Capacity Approximately 96,000 logic elements to implement complex programmable logic, control, and signal-processing functions.
- Embedded Memory Approximately 3.83 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
- I/O Count 169 user I/O pins to connect peripherals, interfaces, and external devices with flexible signal routing.
- Power and Core Voltage Core supply range of 0.95 V to 1.05 V to match low-voltage system architectures.
- Package and Mounting 256-LBGA package (supplier package: 256-SBGA, 27 × 27 mm) optimized for surface-mount assembly and compact board layouts.
- Industrial Temperature Range Rated for operation from −40°C to 100°C for deployment in industrial environments.
- RoHS Compliant Manufactured in accordance with RoHS requirements for restricted hazardous substances.
Unique Advantages
- High logic density: Large logic element count enables implementation of complex functions without immediate need for multiple devices, simplifying board-level design.
- Substantial on-chip memory: Approximately 3.83 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful applications.
- Generous I/O availability: 169 I/Os allow direct connection to numerous peripherals and interfaces, reducing external interface components.
- Industrial-grade operation: −40°C to 100°C rating supports deployment in demanding temperature environments common to industrial applications.
- Compact surface-mount package: 256-LBGA (256-SBGA, 27×27) offers a balance of routing density and board space efficiency for compact designs.
- Low-voltage core compatibility: 0.95–1.05 V supply range aligns with modern low-voltage system power architectures.
Why Choose LFCPNX-100-9ASG256I?
The LFCPNX-100-9ASG256I combines a high count of logic elements, meaningful embedded memory, and a large I/O complement within an industrial-temperature-rated, surface-mount BGA package. It is positioned for designs that need mid-to-high density programmable logic and reliable operation across extended temperature ranges.
This device is suited to engineers and teams seeking a single-chip programmable solution that balances integration, I/O flexibility, and thermal robustness for industrial use cases, while supporting low-voltage core systems.
Request a quote or submit an RFQ to obtain pricing and availability for the LFCPNX-100-9ASG256I.
