LFCPNX-100-9BFG484I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 309 3833856 96000 484-BBGA |
|---|---|
| Quantity | 902 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 309 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24000 | Number of Logic Elements/Cells | 96000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFCPNX-100-9BFG484I – CertusPro™-NX FPGA, 96,000 Logic Elements, 309 I/Os
The LFCPNX-100-9BFG484I is a CertusPro™-NX Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial applications. It delivers a high logic capacity with a broad I/O footprint and on-chip memory for control, interface, and signal-processing tasks.
With 96,000 logic elements, 309 I/Os, and approximately 3.83 Mbits of embedded memory, this surface-mount FPGA targets designs that require moderate to high logic density, substantial I/O integration, and operation across an industrial temperature range.
Key Features
- Core Logic 96,000 logic elements to implement complex combinational and sequential logic functions.
- Embedded Memory Approximately 3.83 Mbits of on-chip RAM for buffering, data storage, and small FPGA-resident memory arrays.
- I/O Capacity 309 user I/Os to support dense external interfacing and multi-channel connectivity.
- Power Supply Low-voltage core operation with a supply range of 950 mV to 1.05 V to match modern low-voltage system rails.
- Package & Mounting 484-BBGA package (supplier device package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board designs.
- Industrial Temperature Grade Specified to operate from −40 °C to 100 °C, suitable for industrial environments.
- Environmental Compliance RoHS compliant, meeting common lead-free requirements for electronic assemblies.
Typical Applications
- Industrial Control & Automation — Implements control logic, I/O aggregation, and protocol conversion while meeting industrial temperature and grade requirements.
- Embedded System Interfaces — Acts as a programmable glue-logic and protocol bridge with substantial I/O count for sensor, actuator, or peripheral integration.
- Signal Processing — Provides on-chip memory and logic resources for real-time data handling, buffering, and preprocessing tasks.
- Communications Gateways — Supports multi-channel interfacing and custom protocol handling using available I/Os and logic density.
Unique Advantages
- High Logic Density: 96,000 logic elements enable consolidation of complex functions into a single device, reducing PCB component count.
- Generous I/O Availability: 309 I/Os support extensive external connectivity, simplifying board-level routing for multi-sensor or multi-peripheral systems.
- On-Chip Memory: Approximately 3.83 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
- Industrial Readiness: Rated for −40 °C to 100 °C and labeled industrial grade, making it suitable for durable fielded equipment.
- Compact Surface-Mount Packaging: 484-BBGA (484-FPBGA, 23 × 23 mm) supports dense board layouts and automated assembly processes.
- RoHS Compliant: Conforms to lead-free manufacturing requirements for global electronics production.
Why Choose LFCPNX-100-9BFG484I?
The LFCPNX-100-9BFG484I positions itself as a balanced, industrial-grade FPGA option that pairs substantial logic resources and embedded memory with a high I/O count and compact package. Its low-voltage core and surface-mount 484-BBGA footprint make it suitable for modern embedded systems that require integration and scalability within constrained board space.
This device is suited for engineers and procurement teams building industrial control, embedded interface, and communications gateway products who need verifiable operating conditions, RoHS compliance, and a high degree of on-chip integration to simplify BOM and board complexity.
Request a quote or submit an inquiry to obtain pricing and availability for the LFCPNX-100-9BFG484I and discuss how it can fit into your next design.