LFCPNX-100-9BBG484I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 484-LFBGA |
|---|---|
| Quantity | 1,504 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CABGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-LFBGA | Number of I/O | 313 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24000 | Number of Logic Elements/Cells | 96000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFCPNX-100-9BBG484I – CertusPro™-NX FPGA, 96,000 Logic Elements, 313 I/Os
The LFCPNX-100-9BBG484I is a CertusPro™-NX Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. As a programmable logic device, it provides a balance of logic capacity, embedded memory, and I/O density for industrial applications.
Key on-chip resources include 96,000 logic elements and approximately 3.8 Mbits of embedded memory, with up to 313 user I/Os. The device is supplied in a 484-LFBGA package for surface-mount assembly and operates across an industrial temperature range of −40 °C to 100 °C with a core supply range of 0.95 V to 1.05 V.
Key Features
- Logic Capacity — 96,000 logic elements provide substantial programmable resources for control, glue logic, and custom digital functions.
- Embedded Memory — Approximately 3.8 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
- I/O Density — Up to 313 user I/Os to support multiple interfaces, sensor connections, and parallel buses.
- Power and Core Voltage — Core supply specification from 0.95 V to 1.05 V to match system power rails and manage power distribution.
- Package & Mounting — 484-LFBGA (484-CABGA, 19 × 19 mm) surface-mount package suitable for compact board layouts.
- Temperature Range & Grade — Industrial grade operation from −40 °C to 100 °C for deployment in demanding environments.
- RoHS Compliant — Conforms to RoHS environmental requirements for restricted substances.
Typical Applications
- Industrial Automation — Implements control logic, motor drive interfaces, and real-time I/O aggregation leveraging industrial temperature range and high I/O count.
- Communications & Networking — Handles protocol glue logic, packet buffering, and custom interfacing using the device's logic density and embedded RAM.
- Embedded Systems & Prototyping — Enables hardware acceleration and custom peripherals for embedded designs needing flexible programmable logic and abundant I/Os.
- Instrumentation & Data Acquisition — Aggregates sensor inputs and performs local preprocessing with available logic resources and on-chip memory.
Unique Advantages
- Significant Logic Density: 96,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing component count.
- On-chip Memory for Local Storage: Approximately 3.8 Mbits of embedded RAM supports buffering and deterministic data handling without external memory.
- High I/O Count: 313 I/Os simplify board-level connectivity for multi-channel systems and mixed-signal interfaces.
- Industrial Temperature Support: Rated from −40 °C to 100 °C to maintain operation in a wide range of environmental conditions.
- Compact Surface-Mount Package: 484-LFBGA footprint (19 × 19 mm) enables high-density PCB designs while supporting robust mounting.
Why Choose LFCPNX-100-9BBG484I?
The LFCPNX-100-9BBG484I positions itself as a programmable logic solution for designers who need a combination of mid-to-high logic capacity, on-chip RAM, and substantial I/O in an industrial-grade FPGA. Its electrical and thermal specifications make it suitable for systems where reliable operation across a broad temperature range is required.
This device is appropriate for engineers building compact, integrated systems that require flexible digital logic, local data buffering, and extensive board-level interfacing. Its package and mounting type support dense PCB layouts, and the provided specifications enable predictable integration into power- and thermal-constrained designs.
Request a quote or submit an RFQ today to receive pricing and availability information for the LFCPNX-100-9BBG484I. Our team can provide the details you need to evaluate this FPGA for your next design.