LFCPNX-100-8LFG672I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 672-BBGA |
|---|---|
| Quantity | 1,447 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 313 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24000 | Number of Logic Elements/Cells | 96000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFCPNX-100-8LFG672I – CertusPro™-NX FPGA, 96,000 Logic Elements, 672-BBGA
The LFCPNX-100-8LFG672I is a CertusPro™-NX Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a mid-to-high logic density FPGA fabric packaged in a 672-ball BGA suitable for surface-mount assembly and industrial applications.
With 96,000 logic elements, approximately 3.8 Mbits of embedded memory, and 313 I/Os, this device targets embedded and industrial designs that require significant on-chip logic, abundant connectivity, and operation across a wide temperature range.
Key Features
- Core Logic 96,000 logic elements for implementing complex digital logic and custom processing functions.
- Embedded Memory Approximately 3.8 Mbits of on-chip RAM to support data buffering, state machines, and local storage without immediate dependence on external memory.
- I/O Capacity 313 I/Os to enable broad interfacing options for sensors, peripherals, and external devices.
- Power Core supply voltage specified from 0.95 V to 1.05 V to match system power-rail requirements and enable low-voltage core operation.
- Package & Mounting 672-BBGA package (supplier device package: 672-FCBGA, 27×27) designed for surface-mount assembly to support compact board layouts.
- Temperature & Grade Industrial-grade device rated for operation from −40°C to 100°C for deployment in demanding environments.
- Regulatory RoHS compliant to meet lead-free assembly and environmental requirements.
Typical Applications
- Industrial Automation Control logic, sensor aggregation, and protocol bridging where industrial temperature range and high I/O count are required.
- Embedded Systems Custom processing and glue-logic in embedded platforms that benefit from significant on-chip logic and local RAM.
- Communications & Networking Interface aggregation and packet processing tasks that utilize multiple I/Os and programmable logic resources.
Unique Advantages
- High logic density: 96,000 logic elements enable implementation of sizable digital designs within a single device.
- Substantial on-chip memory: Approximately 3.8 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
- Extensive I/O count: 313 I/Os provide flexibility for connecting sensors, peripherals, and high-pin-count interfaces without additional I/O expanders.
- Industrial readiness: Rated for −40°C to 100°C and specified as industrial grade for reliable operation in temperature-challenging environments.
- Compact BGA footprint: 672-ball BGA (672-FCBGA, 27×27) supports dense PCB layouts while maintaining high pin count.
- RoHS compliant: Meets lead-free assembly requirements for modern manufacturing processes.
Why Choose LFCPNX-100-8LFG672I?
The LFCPNX-100-8LFG672I positions itself as a capable CertusPro™-NX FPGA option for developers needing a balance of logic capacity, embedded memory, and large I/O capability in an industrial-grade package. Its core voltage range, temperature rating, and package choices make it suitable for robust embedded and industrial applications requiring programmable flexibility and significant on-chip resources.
This device is well-suited for engineering teams designing mid-to-high complexity systems that demand scalability, reliable operation across temperature extremes, and a compact BGA form factor that supports dense board integration.
If you would like pricing, availability, or a formal quote for the LFCPNX-100-8LFG672I, submit a request and our team will respond with the next steps to support your design and procurement needs.