LFCPNX-100-8LFG672I

IC FPGA CERTUSPRO-NX 672BGA
Part Description

CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 672-BBGA

Quantity 1,447 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O313Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24000Number of Logic Elements/Cells96000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits3833856

Overview of LFCPNX-100-8LFG672I – CertusPro™-NX FPGA, 96,000 Logic Elements, 672-BBGA

The LFCPNX-100-8LFG672I is a CertusPro™-NX Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a mid-to-high logic density FPGA fabric packaged in a 672-ball BGA suitable for surface-mount assembly and industrial applications.

With 96,000 logic elements, approximately 3.8 Mbits of embedded memory, and 313 I/Os, this device targets embedded and industrial designs that require significant on-chip logic, abundant connectivity, and operation across a wide temperature range.

Key Features

  • Core Logic  96,000 logic elements for implementing complex digital logic and custom processing functions.
  • Embedded Memory  Approximately 3.8 Mbits of on-chip RAM to support data buffering, state machines, and local storage without immediate dependence on external memory.
  • I/O Capacity  313 I/Os to enable broad interfacing options for sensors, peripherals, and external devices.
  • Power  Core supply voltage specified from 0.95 V to 1.05 V to match system power-rail requirements and enable low-voltage core operation.
  • Package & Mounting  672-BBGA package (supplier device package: 672-FCBGA, 27×27) designed for surface-mount assembly to support compact board layouts.
  • Temperature & Grade  Industrial-grade device rated for operation from −40°C to 100°C for deployment in demanding environments.
  • Regulatory  RoHS compliant to meet lead-free assembly and environmental requirements.

Typical Applications

  • Industrial Automation  Control logic, sensor aggregation, and protocol bridging where industrial temperature range and high I/O count are required.
  • Embedded Systems  Custom processing and glue-logic in embedded platforms that benefit from significant on-chip logic and local RAM.
  • Communications & Networking  Interface aggregation and packet processing tasks that utilize multiple I/Os and programmable logic resources.

Unique Advantages

  • High logic density: 96,000 logic elements enable implementation of sizable digital designs within a single device.
  • Substantial on-chip memory: Approximately 3.8 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
  • Extensive I/O count: 313 I/Os provide flexibility for connecting sensors, peripherals, and high-pin-count interfaces without additional I/O expanders.
  • Industrial readiness: Rated for −40°C to 100°C and specified as industrial grade for reliable operation in temperature-challenging environments.
  • Compact BGA footprint: 672-ball BGA (672-FCBGA, 27×27) supports dense PCB layouts while maintaining high pin count.
  • RoHS compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose LFCPNX-100-8LFG672I?

The LFCPNX-100-8LFG672I positions itself as a capable CertusPro™-NX FPGA option for developers needing a balance of logic capacity, embedded memory, and large I/O capability in an industrial-grade package. Its core voltage range, temperature rating, and package choices make it suitable for robust embedded and industrial applications requiring programmable flexibility and significant on-chip resources.

This device is well-suited for engineering teams designing mid-to-high complexity systems that demand scalability, reliable operation across temperature extremes, and a compact BGA form factor that supports dense board integration.

If you would like pricing, availability, or a formal quote for the LFCPNX-100-8LFG672I, submit a request and our team will respond with the next steps to support your design and procurement needs.

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