LFCPNX-100-9BFG484C

The LFCPNX-100-9BFG484C is a field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation designed for applications that require substantial programmable logic, high I/O density and integrated on-chip memory. The device provides 96,000 logic elements and approximately 3.83 Mbits of embedded RAM, enabling complex logic implementations and medium-scale data buffering.

Packaged in a 484-ball BGA (484-FPBGA, 23×23) with a surface-mount form factor, the device operates at a core voltage range of 0.95 V–1.05 V and is specified for commercial temperature operation (0 °C to 85 °C). It is RoHS compliant for environmental considerations.

Key Features

• Core Logic – 96,000 logic elements suitable for implementing substantial programmable logic functions and custom datapaths.
• Embedded Memory – Approximately 3.83 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for logic blocks.
• I/O Density – 309 I/O pins to support high-channel-count interfaces, parallel buses, and multi‑lane connectivity within a single device.
• Power and Supply – Core voltage supply range of 0.95 V to 1.05 V to match typical low-voltage FPGA power domains.
• Package and Mounting – 484-BBGA (484-FPBGA, 23×23) surface-mount package that balances pin count and board-level density.
• Operating Range and Grade – Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for standard commercial electronic applications.
• Environmental Compliance – RoHS compliant for reduced environmental impact in assembly and disposal.

Typical Applications

• High-density I/O systems – Use the 309 I/O pins for sensor aggregation, multi-channel acquisition, and complex peripheral interfaces requiring many signals.
• Protocol bridging and interface logic – Implement protocol translation and glue logic with ample logic elements and on-chip RAM for packet buffering and staging.
• Embedded control and acceleration – Offload deterministic control loops or custom datapath acceleration into FPGA logic using the integrated memory and logic resources.
• Prototyping and system integration – Rapidly iterate hardware designs that require medium-to-high logic capacity and flexible I/O routing in a compact BGA package.

Unique Advantages

• High logic capacity: 96,000 logic elements provide the resources needed for complex custom logic and parallel processing tasks.
• Significant on-chip RAM: Approximately 3.83 Mbits of embedded memory helps reduce external memory requirements and simplifies board-level design.
• Large I/O count: 309 I/O pins enable consolidation of multiple interfaces into a single device, reducing component count.
• Compact BGA footprint: The 484-FPBGA (23×23) package delivers high pin count in a compact, surface-mount form factor for space-constrained boards.
• Low-voltage core support: Core supply range of 0.95 V–1.05 V aligns with low-voltage power domains common in modern systems.
• RoHS compliant: Meets environmental regulations for lead-free assembly and end-of-life handling.

Why Choose LFCPNX-100-9BFG484C?

The LFCPNX-100-9BFG484C is positioned for commercial designs that require a balance of significant programmable logic, embedded memory, and high I/O capacity in a compact BGA package. Its combination of 96,000 logic elements, approximately 3.83 Mbits of on-chip RAM, and 309 I/O pins makes it suitable for system integration tasks where consolidation of interfaces and custom logic is important.

Designed for surface-mount assembly and commercial temperature operation, the device offers a practical platform for engineers developing medium-to-high complexity FPGA-based solutions while maintaining compliance with RoHS environmental requirements.

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