LFCPNX-100-9LFG672I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 313 3833856 96000 672-BBGA |
|---|---|
| Quantity | 1,689 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 313 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24000 | Number of Logic Elements/Cells | 96000 | ||
| Number of Gates | N/A | ECCN | 5A992C 24 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFCPNX-100-9LFG672I – CertusPro™-NX FPGA, 672-BBGA
The LFCPNX-100-9LFG672I is an industrial-grade CertusPro™-NX field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a high-density programmable logic fabric with a substantial embedded memory complement and a large I/O count for I/O‑intensive system designs.
Designed for surface-mount assembly in a 672-ball BGA, this device targets industrial and embedded applications that require scalable logic capacity, flexible I/O, and operation across a wide temperature range.
Key Features
- Logic Capacity — Provides 96,000 logic elements to implement complex custom logic and system functions.
- Embedded Memory — Includes approximately 3.83 Mbits of on‑chip RAM for buffering, packet storage, and state machines.
- I/O Resources — Offers 313 I/O pins to support high pin-count interfacing and multiple parallel buses or channels.
- Power — Core supply specification ranges from 950 mV to 1.05 V, enabling integration into low-voltage power architectures.
- Package & Mounting — Supplied in a 672-BBGA package and listed as 672‑FCBGA (27×27); designed for surface-mount assembly.
- Operating Range — Rated for industrial temperature operation from −40 °C to 100 °C.
- Compliance — RoHS compliant, supporting lead‑free manufacturing requirements.
Typical Applications
- Industrial Control and Automation — Implement custom control logic, I/O aggregation, and real‑time signal handling within industrial systems operating across extended temperatures.
- Embedded Processing — Add programmable acceleration and glue logic to embedded platforms using the device’s large logic element and memory resources.
- I/O-Intensive Interfaces — Drive parallel buses, protocol bridging, and multi-channel data paths with the high I/O count.
- OEM System Integration — Use as a configurable subsystem to consolidate discrete components and simplify BOMs in OEM designs.
Unique Advantages
- High Logic Density: 96,000 logic elements enable consolidation of numerous functions into a single programmable device, reducing system complexity.
- Meaningful On‑Chip Memory: Approximately 3.83 Mbits of embedded RAM support buffering, packet handling, and state retention without external memory.
- Extensive I/O Count: 313 I/O pins provide flexibility to connect multiple peripherals, sensors, or external interfaces directly to the FPGA.
- Industrial Temperature Capability: Specified operation from −40 °C to 100 °C supports deployment in harsh or wide‑temperature environments.
- Compact BGA Package: 672‑ball BGA (672‑FCBGA (27×27)) offers a compact footprint for high‑density system boards while supporting surface‑mount assembly.
- RoHS Compliance: Enables use in lead‑free manufacturing workflows.
Why Choose LFCPNX-100-9LFG672I?
The LFCPNX-100-9LFG672I combines substantial programmable logic, a significant embedded memory complement, and broad I/O resources in an industrial-grade FPGA package. Its electrical and thermal specifications make it suitable for embedded and industrial system designs that require scalable custom logic and reliable operation across extended temperatures.
For design teams looking to reduce component count, consolidate functions, and maintain flexibility throughout development and production, this CertusPro™-NX device offers a balanced mix of capacity, I/O, and industrial robustness to support long-term deployment.
Request a quote or submit a request for pricing and availability to begin integrating the LFCPNX-100-9LFG672I into your next design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016