LFCPNX-50-7ASG256C
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 167 1769472 52000 256-LBGA |
|---|---|
| Quantity | 1,422 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-SBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 167 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13000 | Number of Logic Elements/Cells | 52000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of LFCPNX-50-7ASG256C – CertusPro™-NX Field Programmable Gate Array (FPGA), 256-LBGA, 52,000 Logic Elements
The LFCPNX-50-7ASG256C is a CertusPro™-NX FPGA offered in a 256-LBGA package and designed for commercial applications requiring substantial programmable logic and on-chip memory. It provides a balance of high logic density, significant embedded RAM, and flexible I/O in a compact surface-mount package.
This device is suitable for designs that need up to 52,000 logic elements, approximately 1.77 Mbits of embedded memory, and 167 I/O pins while operating within a 0 °C to 85 °C temperature range and a core voltage window of 0.95 V to 1.05 V.
Key Features
- Core Logic: Offers 52,000 logic elements to implement complex digital functions and custom hardware acceleration.
- Configurable Logic Blocks (CLBs): 13,000 CLBs (logic block count provided) to structure synthesized logic into modular resources.
- Embedded Memory: Approximately 1.77 Mbits of on-chip RAM for FIFOs, buffers, and local data storage to support mid-sized designs.
- I/O Capacity: 167 general-purpose I/O pins to interface with sensors, peripherals, and external memories.
- Power and Voltage: Core supply range of 0.95 V to 1.05 V to match platform power budgets and regulator designs.
- Package & Mounting: 256-LBGA (256-SBGA, 27 × 27) surface-mount package for compact board-level integration.
- Operating Range: Commercial-grade operating temperature from 0 °C to 85 °C, suitable for standard commercial environments.
- Compliance: RoHS-compliant lead-free construction for regulatory and assembly compatibility.
Typical Applications
- High-density digital processing: Use the 52,000 logic elements and on-chip RAM to implement custom data-paths, protocol processing, or hardware accelerators.
- Embedded system control: Leverage 167 I/O pins and embedded memory to manage sensors, user interfaces, and peripheral control in compact designs.
- Prototyping and development: The combination of logic density and a compact 256-LBGA package supports board-level prototyping of mid-range FPGA designs.
Unique Advantages
- Substantial logic density: 52,000 logic elements enable integration of multiple functions on a single device, reducing external components.
- Meaningful on-chip RAM: Approximately 1.77 Mbits of embedded memory helps minimize external memory requirements for buffering and intermediate storage.
- Generous I/O count: 167 I/Os allow flexible interfacing with a variety of peripherals and external devices without additional I/O expanders.
- Compact footprint: 256-LBGA (27 × 27) packaging supports space-constrained board layouts while retaining high pin count.
- Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliance for deployments in standard commercial environments.
Why Choose LFCPNX-50-7ASG256C?
The LFCPNX-50-7ASG256C positions itself as a robust, mid-to-high density programmable logic device that combines sizable logic resources, embedded memory, and broad I/O in a compact surface-mount LBGA package. Its electrical and thermal ranges make it a practical choice for commercial embedded designs that require on-chip flexibility without sacrificing board space.
Designers and procurement teams looking for a scalable FPGA building block will find value in the device’s balance of integration and I/O capability, which can simplify bill-of-materials and support iterative development across multiple product versions.
Request a quote or submit a pricing inquiry to obtain availability and procurement details for the LFCPNX-50-7ASG256C.