LFCPNX-50-7ASG256C

IC FPGA CERTUSPRO-NX 256WLP
Part Description

CertusPro™-NX Field Programmable Gate Array (FPGA) IC 167 1769472 52000 256-LBGA

Quantity 1,422 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-SBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O167Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13000Number of Logic Elements/Cells52000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1769472

Overview of LFCPNX-50-7ASG256C – CertusPro™-NX Field Programmable Gate Array (FPGA), 256-LBGA, 52,000 Logic Elements

The LFCPNX-50-7ASG256C is a CertusPro™-NX FPGA offered in a 256-LBGA package and designed for commercial applications requiring substantial programmable logic and on-chip memory. It provides a balance of high logic density, significant embedded RAM, and flexible I/O in a compact surface-mount package.

This device is suitable for designs that need up to 52,000 logic elements, approximately 1.77 Mbits of embedded memory, and 167 I/O pins while operating within a 0 °C to 85 °C temperature range and a core voltage window of 0.95 V to 1.05 V.

Key Features

  • Core Logic: Offers 52,000 logic elements to implement complex digital functions and custom hardware acceleration.
  • Configurable Logic Blocks (CLBs): 13,000 CLBs (logic block count provided) to structure synthesized logic into modular resources.
  • Embedded Memory: Approximately 1.77 Mbits of on-chip RAM for FIFOs, buffers, and local data storage to support mid-sized designs.
  • I/O Capacity: 167 general-purpose I/O pins to interface with sensors, peripherals, and external memories.
  • Power and Voltage: Core supply range of 0.95 V to 1.05 V to match platform power budgets and regulator designs.
  • Package & Mounting: 256-LBGA (256-SBGA, 27 × 27) surface-mount package for compact board-level integration.
  • Operating Range: Commercial-grade operating temperature from 0 °C to 85 °C, suitable for standard commercial environments.
  • Compliance: RoHS-compliant lead-free construction for regulatory and assembly compatibility.

Typical Applications

  • High-density digital processing: Use the 52,000 logic elements and on-chip RAM to implement custom data-paths, protocol processing, or hardware accelerators.
  • Embedded system control: Leverage 167 I/O pins and embedded memory to manage sensors, user interfaces, and peripheral control in compact designs.
  • Prototyping and development: The combination of logic density and a compact 256-LBGA package supports board-level prototyping of mid-range FPGA designs.

Unique Advantages

  • Substantial logic density: 52,000 logic elements enable integration of multiple functions on a single device, reducing external components.
  • Meaningful on-chip RAM: Approximately 1.77 Mbits of embedded memory helps minimize external memory requirements for buffering and intermediate storage.
  • Generous I/O count: 167 I/Os allow flexible interfacing with a variety of peripherals and external devices without additional I/O expanders.
  • Compact footprint: 256-LBGA (27 × 27) packaging supports space-constrained board layouts while retaining high pin count.
  • Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliance for deployments in standard commercial environments.

Why Choose LFCPNX-50-7ASG256C?

The LFCPNX-50-7ASG256C positions itself as a robust, mid-to-high density programmable logic device that combines sizable logic resources, embedded memory, and broad I/O in a compact surface-mount LBGA package. Its electrical and thermal ranges make it a practical choice for commercial embedded designs that require on-chip flexibility without sacrificing board space.

Designers and procurement teams looking for a scalable FPGA building block will find value in the device’s balance of integration and I/O capability, which can simplify bill-of-materials and support iterative development across multiple product versions.

Request a quote or submit a pricing inquiry to obtain availability and procurement details for the LFCPNX-50-7ASG256C.

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