LFCPNX-100-8BFG484C
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 309 3833856 96000 484-BBGA |
|---|---|
| Quantity | 704 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 309 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24000 | Number of Logic Elements/Cells | 96000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFCPNX-100-8BFG484C – CertusPro™-NX Field Programmable Gate Array (FPGA), 484-BBGA, 309 I/Os
The LFCPNX-100-8BFG484C is a CertusPro™-NX Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a high-capacity programmable logic fabric with substantial embedded memory and a high I/O count in a compact 484-BBGA package, targeted for commercial embedded designs.
Designed for applications that require flexible, high-density logic and abundant external interfacing, this device combines 96,000 logic elements with approximately 3.83 Mbits of on-chip RAM and a wide I/O complement while operating within a commercial temperature range.
Key Features
- Core Logic 96,000 logic elements provide significant programmable capacity for complex logic, state machines, and custom datapaths.
- Embedded Memory Approximately 3.83 Mbits of on-chip RAM suitable for buffering, FIFOs, and local data storage within programmable logic.
- I/O Density 309 I/O pins to support extensive external interfacing and parallel connections to peripherals and sensors.
- Power Core supply voltage range of 0.95 V to 1.05 V enables compatibility with low-voltage power architectures.
- Package and Mounting 484-BBGA (supplier package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board integration.
- Operating Environment Commercial operating temperature range of 0 °C to 85 °C and RoHS compliance for standard commercial deployments.
Typical Applications
- Commercial Embedded Systems — Implements custom logic and control functions for general-purpose embedded platforms that require mid-to-high logic capacity and substantial I/O.
- Interface Aggregation — Aggregates and bridges multiple high-pin-count interfaces using the device’s 309 I/Os and programmable fabric.
- Data Buffering and Processing — Uses the approximately 3.83 Mbits of embedded RAM alongside logic elements for on-chip buffering, packet handling, and intermediate data processing.
Unique Advantages
- High Logic Capacity: 96,000 logic elements provide headroom for complex designs and feature-rich implementations.
- Substantial On-Chip RAM: Approximately 3.83 Mbits of embedded memory reduces the need for external RAM in many buffering and temporary storage use cases.
- Large I/O Count: 309 I/Os enable broad external connectivity and support for multiple parallel interfaces.
- Compact BGA Packaging: 484-BBGA (23 × 23 mm) balances density and board-level integration for space-constrained designs.
- Low-Voltage Core: 0.95 V–1.05 V supply range aligns with modern low-voltage power domains to help optimize system power budgets.
- Commercial Temperature Grade: Rated 0 °C to 85 °C for standard commercial deployments and environments.
Why Choose LFCPNX-100-8BFG484C?
The LFCPNX-100-8BFG484C positions itself as a high-capacity, commercially graded FPGA suited to embedded designs that demand a combination of substantial logic resources, meaningful on-chip RAM, and a high I/O count in a compact BGA package. Its low-voltage core and surface-mount 484-BBGA footprint enable integration into contemporary board designs while supporting a broad set of interfacing requirements.
This part is appropriate for design teams building commercial products that require programmable flexibility, on-chip memory for intermediate data handling, and extensive external connectivity, offering a scalable foundation for feature-rich embedded systems.
Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the LFCPNX-100-8BFG484C.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016