LFCPNX-100-7ASG256I

IC FPGA CERTUSPRO-NX 256WLP
Part Description

CertusPro™-NX Field Programmable Gate Array (FPGA) IC 169 3833856 96000 256-LBGA

Quantity 1,453 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-SBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O169Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24000Number of Logic Elements/Cells96000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFCPNX-100-7ASG256I – CertusPro™-NX FPGA, 96,000 Logic Elements, 256‑LBGA

The LFCPNX-100-7ASG256I is a CertusPro™-NX Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a high-density programmable fabric with 96,000 logic elements and approximately 3.83 Mbits of embedded RAM in a compact surface-mount package.

This device targets designs that require substantial on-chip logic, memory and I/O capability within an industrial-grade component offering, including operation across a wide temperature range and a low-voltage core supply range.

Key Features

  • Core Logic  Provides 96,000 logic elements to implement complex digital functions and state machines.
  • On-Chip Memory  Approximately 3.83 Mbits of total RAM bits for buffering, lookup tables and embedded storage.
  • I/O Capacity  169 available I/O pins to support multi-signal interfaces and board-level connectivity.
  • Power Supply  Core voltage supply range of 0.95 V to 1.05 V, suitable for designs that target low-voltage FPGA operation.
  • Package and Mounting  256‑ball L‑BGA package; supplier device package listed as 256‑SBGA (27×27 mm), surface-mount mounting for compact PCB integration.
  • Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C to meet demanding environmental conditions.
  • RoHS Compliant  Lead-free, RoHS-compliant device suitable for environmentally regulated designs.

Unique Advantages

  • High logic density: 96,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
  • Significant embedded memory: Approximately 3.83 Mbits of RAM supports on-chip buffering and data processing without immediate dependence on external memory.
  • Generous I/O: 169 I/O pins provide flexibility for diverse interface requirements and multiple parallel connections.
  • Industrial robustness: −40 °C to 100 °C operating range supports deployments in industrial environments.
  • Compact, surface-mount package: 256‑LBGA / 256‑SBGA (27×27 mm) enables dense PCB layouts and compact system designs.
  • Controlled core voltage range: 0.95–1.05 V core supply allows integration into low-voltage power architectures.

Why Choose LFCPNX-100-7ASG256I?

The LFCPNX-100-7ASG256I balances high logic capacity, substantial embedded memory and broad I/O in a compact industrial-grade package. Its combination of 96,000 logic elements, approximately 3.83 Mbits of on-chip RAM and 169 I/O make it well suited for complex embedded systems that require on-chip integration and reliable operation across a wide temperature range.

This device is appropriate for designers seeking a programmable solution that supports dense logic implementation and compact board integration while operating from a low-voltage core supply. Its RoHS compliance and surface-mount 256-ball package simplify manufacturing and environmental compliance considerations.

Request a quote or submit a product request for LFCPNX-100-7ASG256I to obtain pricing and availability information.

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