LFCPNX-50-7BFG484I

The LFCPNX-50-7BFG484I is a CertusPro™-NX field programmable gate array (FPGA) IC designed for industrial applications requiring mid-range logic capacity and flexible I/O. It combines 52,000 logic elements with approximately 1.77 Mbits of embedded memory to support complex digital functions in a compact 484-ball BGA package. The device targets designs that need high I/O count, low-voltage core operation, and operation across an extended industrial temperature range.

Key Features

• Core Logic — 52,000 logic elements provide the programmable fabric to implement custom digital logic and control functions.
• Embedded Memory — Approximately 1.77 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for user logic.
• I/O Density — 273 user I/O pins accommodate multiple external peripherals, high-pin-count interfaces, and board-level routing flexibility.
• Power — Core supply operating range of 950 mV to 1.05 V to match low-voltage system architectures.
• Package and Mounting — 484-ball BGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board integration.
• Temperature Range — Industrial operating range from −40 °C to 100 °C for deployment in thermally demanding environments.
• Compliance — RoHS-compliant construction for regulatory and manufacturing compatibility.

Unique Advantages

• High logic capacity: 52,000 logic elements enable implementation of sizeable custom logic blocks and state machines without external ASICs.
• Substantial embedded memory: Approximately 1.77 Mbits of RAM supports on-chip buffering and data handling, reducing external memory requirements.
• Extensive I/O: 273 available I/O pins simplify interfacing to sensors, controllers, and high-pin-count connectors, reducing the need for I/O expanders.
• Industrial temperature tolerance: Rated for −40 °C to 100 °C operation, suitable for factory, instrumentation, and field-deployed equipment.
• Low-voltage core operation: 950 mV to 1.05 V supply range aligns with modern low-power power rails and system designs.
• Compact BGA package: 484-ball FPBGA (23×23) enables dense PCB layouts while maintaining robust solder and thermal properties for surface-mount assembly.

Why Choose LFCPNX-50-7BFG484I?

The LFCPNX-50-7BFG484I positions itself as a mid-capacity, industrial-grade FPGA solution that balances logic density, on-chip memory, and high I/O count in a compact BGA package. It is suited for engineers building control systems, communications interfaces, and embedded processing functions that require a programmable, reconfigurable hardware platform.

By combining low-voltage core operation, RoHS compliance, and an extended operating temperature range, this device offers long-term deployment viability and integration flexibility for industrial designs where board space, I/O breadth, and thermal robustness are key considerations.

Request a quote or submit an inquiry to receive pricing and availability for the LFCPNX-50-7BFG484I. Our team can provide lead-time details and support to help evaluate the device for your design.