LFCPNX-50-8ASG256I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 167 1769472 52000 256-LBGA |
|---|---|
| Quantity | 637 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-SBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 167 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13000 | Number of Logic Elements/Cells | 52000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of LFCPNX-50-8ASG256I – CertusPro™-NX Field Programmable Gate Array (FPGA) IC
The LFCPNX-50-8ASG256I is a CertusPro™-NX Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded applications. It provides a high logic capacity and substantial on-chip memory in a compact 256-LBGA surface-mount package, with a low-voltage supply range and extended operating temperature for robust deployment.
With 52,000 logic elements, approximately 1.77 Mbits of embedded memory, and 167 I/O pins, this device targets designs that require dense programmable logic, significant local storage, and flexible interfacing in industrial environments.
Key Features
- Core Logic 52,000 logic elements provide substantial programmable resources for complex combinational and sequential logic implementations.
- Configurable Logic Blocks 13,000 CLBs enable structured logic partitioning and mapping for efficient design implementation.
- Embedded Memory Approximately 1.77 Mbits of on-chip RAM supports data buffering, state storage, and small lookup tables without external memory.
- I/O Count 167 general-purpose I/O pins allow for broad interfacing options to sensors, peripherals, and external devices.
- Power Operates from a 0.95 V to 1.05 V supply range, supporting low-voltage system designs.
- Package & Mounting 256-LBGA (256-SBGA, 27 × 27) surface-mount package balances high pin count with a compact PCB footprint.
- Temperature & Grade Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environments.
- RoHS Compliant Meets RoHS requirements for lead-free manufacturing and environmental compliance.
Typical Applications
- Industrial Control & Automation — Uses the device's industrial temperature range and high I/O count to implement control logic, PLC functions, and interface aggregation in factory and process systems.
- High-Density Programmable Logic — Leverages 52,000 logic elements and on-chip memory for complex protocol handling, custom accelerators, and data processing tasks.
- Interface Bridging & I/O Expansion — 167 I/Os provide flexibility for protocol translation, sensor aggregation, and custom peripheral interfaces in embedded platforms.
Unique Advantages
- High Logic Density: 52,000 logic elements enable implementation of large, integrated logic functions without immediate need for additional FPGAs.
- Substantial On-Chip Memory: Approximately 1.77 Mbits of embedded RAM reduce reliance on external memory for buffering and small data stores.
- Generous I/O Capacity: 167 I/O pins support diverse peripheral connections and multi-channel interfacing on a single device.
- Low-Voltage Operation: 0.95 V to 1.05 V supply range helps designs targeting lower power budgets and modern low-voltage system rails.
- Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for extended-temperature deployments in industrial environments.
- Compact, High-Pin Package: 256-LBGA (27 × 27) package delivers high pin count in a space-efficient surface-mount footprint.
Why Choose LFCPNX-50-8ASG256I?
The LFCPNX-50-8ASG256I positions itself as a high-capacity, industrial-grade FPGA option that combines significant logic resources, embedded memory, and extensive I/O in a compact package. Its low-voltage operation and extended temperature range make it suitable for designs that demand robust, space-efficient programmable logic with broad interfacing capability.
This device is well suited for engineering teams developing industrial control systems, interface consolidation solutions, or high-density programmable logic applications that require reliable operation across temperature extremes and minimized external memory requirements.
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