LFCPNX-50-8BFG484C
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 273 1769472 52000 484-BBGA |
|---|---|
| Quantity | 382 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 273 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13000 | Number of Logic Elements/Cells | 52000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of LFCPNX-50-8BFG484C – CertusPro™-NX Field Programmable Gate Array (FPGA), 484-BBGA
The LFCPNX-50-8BFG484C is a CertusPro™-NX field programmable gate array (FPGA) optimized for commercial applications requiring substantial logic, embedded memory and high I/O density. Its architecture provides 52,000 logic elements across 13,000 logic blocks with approximately 1.77 Mbits of on-chip RAM, enabling complex glue logic, protocol adaptation and custom hardware acceleration within a single device.
Packaged in a compact 484-BBGA (supplier package 484-FPBGA, 23×23 mm) and designed for surface-mount assembly, this FPGA operates from a 0.95 V to 1.05 V core supply and is specified for 0 °C to 85 °C commercial operating temperature.
Key Features
- Core Logic 52,000 logic elements organized into 13,000 logic blocks to implement complex logic fabrics and custom processing pipelines.
- Embedded Memory Approximately 1.77 Mbits of on‑chip RAM for buffering, packet storage and stateful processing without external memory.
- I/O Density 273 I/O pins to support dense peripheral and interface requirements, enabling multiple parallel connections to external devices.
- Power Narrow core voltage range of 0.95 V to 1.05 V for predictable power planning and integration with regulated power supplies.
- Package & Mounting 484-BBGA package (supplier: 484-FPBGA, 23×23 mm) designed for surface-mount assembly to save board area while delivering high I/O count.
- Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant for mainstream commercial deployments.
Typical Applications
- Consumer and Commercial Electronics — Implement custom peripherals, protocol bridging and user‑interface control where substantial logic and I/O are required.
- Communications and Networking — Use the available logic and on‑chip RAM to build packet processing, framing or protocol adaptation functions with high I/O connectivity.
- Embedded Control Systems — Integrate control logic and deterministic processing for machines and systems operating within commercial temperature ranges.
- Data Handling and Buffering — Leverage approximately 1.77 Mbits of embedded memory for temporary storage, FIFOs and buffering between subsystems.
Unique Advantages
- Substantial Logic Capacity: 52,000 logic elements across 13,000 logic blocks enable implementation of complex custom hardware functions on-chip.
- High On‑Chip Memory: Approximately 1.77 Mbits of RAM reduces dependence on external memory for many buffering and stateful tasks.
- High I/O Count: 273 I/O pins simplify board-level routing for multi-channel interfaces and peripheral-rich designs.
- Space-Efficient Packaging: 484-BBGA (484-FPBGA, 23×23 mm) delivers high integration in a compact surface-mount form factor.
- Predictable Power Envelope: Defined core voltage range (0.95–1.05 V) assists in power supply selection and thermal planning.
- RoHS Compliant: Conforms to RoHS requirements for commercial manufacturing and deployment.
Why Choose LFCPNX-50-8BFG484C?
The LFCPNX-50-8BFG484C balances significant logic density, embedded memory and a high I/O count in a compact 484-BBGA package, making it well suited for commercial designs that require on‑chip processing, buffering and multiple external interfaces. Its defined power and temperature specifications simplify system-level integration and qualification for mainstream applications.
This device is appropriate for engineering teams and procurement professionals seeking a commercial-grade FPGA with ample resources for prototyping and production designs that demand moderate to high logic capacity, substantial embedded RAM and dense I/O connectivity.
Request a quote or contact sales to discuss availability, lead times and pricing for the LFCPNX-50-8BFG484C.

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