LFCPNX-50-8BBG484I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 273 1769472 52000 484-LFBGA |
|---|---|
| Quantity | 848 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CABGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-LFBGA | Number of I/O | 273 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13000 | Number of Logic Elements/Cells | 52000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of LFCPNX-50-8BBG484I – CertusPro™-NX Field Programmable Gate Array (FPGA), 484-LFBGA
The LFCPNX-50-8BBG484I is a CertusPro™-NX Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial applications. It provides a combination of programmable logic, embedded memory and a high I/O count in a compact 484-LFBGA package.
With 52,000 logic elements, approximately 1.77 Mbits of on-chip RAM and 273 I/O pins, this device targets designs that require significant programmable logic capacity, substantial embedded memory, and dense I/O while operating across an industrial temperature range.
Key Features
- Core Logic 52,000 logic elements for implementing complex programmable logic and custom digital functions.
- Embedded Memory Approximately 1.77 Mbits of on-chip RAM (1,769,472 bits) to support data buffering, state storage and local processing.
- I/O Density 273 I/O pins provide extensive external connectivity for sensors, peripherals and high-channel-count interfaces.
- Power Operation from a core supply range of 0.95 V to 1.05 V to match low-voltage system architectures.
- Package & Mounting 484-LFBGA package (supplier package: 484-CABGA, 19×19) in a surface-mount form factor for compact board designs.
- Temperature & Grade Industrial-grade operation from −40 °C to 100 °C for use in temperature-demanding environments.
- Compliance RoHS-compliant construction for environmental regulatory alignment.
Typical Applications
- Industrial control and automation Use the FPGA’s logic capacity and industrial temperature range to implement control logic, custom I/O handling and local processing in automation equipment.
- High-density I/O aggregation 273 I/O pins enable consolidation of multiple sensor and peripheral interfaces into a single programmable device.
- Embedded processing and buffering Approximately 1.77 Mbits of embedded RAM support intermediate data storage and streaming tasks for real-time processing.
- Test and measurement systems Programmable logic and abundant I/O allow flexible implementation of signal conditioning, timing control and interface adaptation.
Unique Advantages
- High integration: 52,000 logic elements plus embedded memory reduce board-level component count by consolidating functions into a single FPGA.
- Large I/O complement: 273 I/O pins simplify designs that require many external connections without needing additional interface chips.
- Industrial robustness: Specified for −40 °C to 100 °C operation to meet environmental needs of industrial equipment.
- Compact surface-mount package: 484-LFBGA (484-CABGA, 19×19) enables space-efficient placement on densely populated PCBs.
- Low-voltage core operation: Core supply range of 0.95 V to 1.05 V supports low-voltage system designs and power-optimized implementations.
- Regulatory alignment: RoHS compliance supports environmentally conscious product development and procurement.
Why Choose LFCPNX-50-8BBG484I?
The LFCPNX-50-8BBG484I positions itself as a versatile, industrial-grade FPGA choice when a balance of logic capacity, embedded memory and high I/O is required in a compact package. Its specification set supports developers who need to consolidate multiple functions into a single programmable device while meeting temperature and environmental requirements.
This device is appropriate for engineering teams building robust embedded systems, automation equipment, and measurement platforms that benefit from scalable programmable logic, substantial on-chip RAM and extensive external connectivity backed by Lattice Semiconductor Corporation’s product family.
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