LFCPNX-50-8BFG484I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 273 1769472 52000 484-BBGA |
|---|---|
| Quantity | 1,066 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | Tray | Number of I/O | 273 | Voltage | 950 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | N/A | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 13000 | Number of Logic Elements/Cells | 52000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of LFCPNX-50-8BFG484I – CertusPro™-NX Field Programmable Gate Array (FPGA), 484-FPBGA (23×23)
The LFCPNX-50-8BFG484I is a CertusPro™-NX Field Programmable Gate Array (FPGA) IC that delivers a balanced combination of programmable logic, on-chip memory, and extensive I/O in a compact BGA package. It provides designers with a configurable hardware platform featuring 52,000 logic elements, approximately 1.77 Mbits of embedded memory, and 273 I/Os.
Packaged in a 484-FPBGA (23×23) surface-mount package and rated for industrial temperature operation, this device is suited for embedded systems and applications requiring significant programmable logic and memory in a compact footprint.
Key Features
- Core Logic: 52,000 logic elements provide abundant programmable fabric for custom digital functions and logic integration.
- Embedded Memory: Approximately 1.77 Mbits of on-chip RAM (1,769,472 bits) for buffering, lookup tables, and data storage without external memory.
- I/O Density: 273 I/O pins to support wide peripheral interfacing, bus connections, and signal routing.
- Power Supply: Voltage supply specified at 950 mV for the device core.
- Package & Mounting: Supplier device package is 484-FPBGA (23×23) in a surface-mount form factor; devices supplied in tray packaging.
- Operating Range: Industrial-grade operation from -40 °C to 100 °C for deployment across a range of environmental conditions.
Unique Advantages
- High logic capacity: 52,000 logic elements enable complex custom logic and substantial parallel processing within a single device, reducing external component count.
- Generous on-chip memory: Approximately 1.77 Mbits of embedded RAM supports local buffering and data handling without immediate reliance on external memory.
- Extensive I/O resources: 273 I/Os provide flexibility for interfacing with multiple peripherals, sensors, and external buses from one FPGA.
- Industrial temperature support: Rated from -40 °C to 100 °C for reliable operation in temperature-challenging environments.
- Compact BGA footprint: 484-FPBGA (23×23) package balances high pin count with a compact board area for dense system integration.
Why Choose LFCPNX-50-8BFG484I?
The LFCPNX-50-8BFG484I offers a practical mix of programmable logic, embedded memory, and abundant I/O in a compact BGA package, making it a strong option for designs that require substantial on-chip resources within an industrial temperature range. Its specification set supports integration of custom digital functions while minimizing external component needs.
This part is suitable for development teams and procurement looking for a configurable FPGA platform with clear, quantifiable resources—logic elements, memory bits, and I/O count—delivered in a surface-mount 484-FPBGA package for space-constrained boards.
Request a quote or contact sales to discuss pricing, availability, and lead times for LFCPNX-50-8BFG484I.

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