LFD2NX-40-7BG256I
| Part Description |
Certus™-NX Field Programmable Gate Array (FPGA) IC 192 1548288 39000 256-LFBGA |
|---|---|
| Quantity | 1,397 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 192 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9750 | Number of Logic Elements/Cells | 39000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1548288 |
Overview of LFD2NX-40-7BG256I – Certus™-NX FPGA, 39,000 Logic Elements, 192 I/Os, 256-LFBGA
The LFD2NX-40-7BG256I is a Certus™-NX family field programmable gate array (FPGA) designed for industrial applications that require mid-range programmable logic, embedded memory and flexible I/O. Built on the Certus‑NX architecture, this device combines 9,750 configurable logic blocks (CLBs) delivering 39,000 logic elements with approximately 1.55 Mbits of on‑chip RAM and 192 I/O pins to support a range of embedded processing, memory interface and high‑speed I/O tasks.
Key engineering values include configurable compute resources, a compact 256‑LFBGA (256‑CABGA 14×14) package for surface‑mount assembly, and industrial temperature operation from −40 °C to 100 °C with a core supply range of 950 mV to 1.05 V.
Key Features
- Programmable Logic Capacity — 9,750 CLBs providing a total of 39,000 logic elements to implement custom logic, control engines and protocol handling.
- Embedded Memory — Approximately 1.55 Mbits of on‑chip RAM for FIFOs, buffers and tightly coupled data storage.
- I/O and Packaging — 192 general‑purpose I/O pins in a 256‑LFBGA (supplier package: 256‑CABGA, 14×14) surface‑mount package to support broad board‑level integration.
- Power and Thermal — Core voltage supply from 950 mV to 1.05 V and industrial operating temperature range of −40 °C to 100 °C for robust operation in demanding environments.
- Clocking and Timing — On‑chip clocking resources including global PLLs, clock distribution network and DDRDLL capabilities as described in the Certus‑NX family documentation.
- Memory and DSP Subsystems — sysMEM and large RAM support, plus sysDSP architecture elements in the Certus‑NX family for high‑throughput data processing and memory interfacing.
- High‑Speed Interfaces and I/O Features — Family documentation describes support for DDR memory interfaces, SGMII clock data recovery, MIPI D‑PHY and a versatile programmable I/O cell (PIC) architecture.
- Analog and System Integration — Certus‑NX family includes analog interfaces such as ADCs, continuous time comparators and an internal junction temperature monitor.
- Configuration and Reliability — Enhanced configuration options including dual‑boot and multi‑boot image support, boundary scan testability and SEU support as detailed for the Certus‑NX family.
- Standards and Compliance — Device is RoHS‑compliant.
Typical Applications
- Networking & Communications — Use the device’s clocking resources, SGMII CDR capability and flexible I/O to implement packet processing, interface bridging and timing‑sensitive link logic.
- Memory Interface Controllers — Built‑in DDR support, sysMEM blocks and approximately 1.55 Mbits of on‑chip RAM make the device suitable for memory buffering and controller functions.
- Embedded Signal Processing — sysDSP resources and abundant logic elements enable acceleration of compute kernels, protocol offload and real‑time data manipulation.
- Imaging & Sensor Interfaces — MIPI D‑PHY support and mixed‑signal interfaces help implement camera, sensor aggregation and pre‑processing pipelines.
- Industrial Control & Automation — Industrial temperature rating, flexible I/O and configurable logic support motor control, machine I/O aggregation and custom protocol implementations.
Unique Advantages
- Balanced Logic and Memory — 39,000 logic elements paired with approximately 1.55 Mbits of embedded RAM lets designers partition logic and data storage on a single device, reducing board‑level complexity.
- Robust Industrial Operation — Specified operation from −40 °C to 100 °C ensures suitability for industrial environments where temperature range matters.
- Flexible I/O in a Compact Package — 192 I/Os in a 256‑LFBGA (14×14) surface‑mount package provides a compact footprint while preserving board‑level connectivity options.
- Advanced Clocking & DDR Support — On‑chip PLLs, clock distribution and DDRDLL features support precise timing, high‑speed memory interfaces and deterministic system behavior.
- System Integration Features — Family features such as dual‑boot configuration, boundary scan and SEU support contribute to system reliability and maintainability.
- Rich I/O and Analog Options — Programmable I/O cell architecture plus ADC and comparator resources enable mixed‑signal and multi‑standard designs without excessive external components.
Why Choose LFD2NX-40-7BG256I?
The LFD2NX-40-7BG256I positions itself as a versatile mid‑density FPGA choice within the Certus‑NX family, offering a balanced combination of logic resources, embedded memory and flexible I/O in a compact 256‑LFBGA package. Its industrial temperature rating and RoHS compliance make it suitable for production systems requiring extended environmental range and regulatory adherence.
This device is well suited to engineers building networked products, memory interface controllers, embedded signal processing engines and industrial control systems who need integrated clocking, DDR support and on‑chip memory to simplify designs and reduce bill‑of‑materials. The Certus‑NX family documentation provides additional architecture-level capabilities—such as sysDSP, sysMEM, clocking and configuration options—that support scalable design choices and long‑term deployment.
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