LFD2NX-40-7MG121A
| Part Description |
Certus™-NX Field Programmable Gate Array (FPGA) IC 71 1548288 39000 121-VFBGA, CSPBGA |
|---|---|
| Quantity | 489 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 121-CSFBGA (6x6) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 121-VFBGA, CSPBGA | Number of I/O | 71 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9750 | Number of Logic Elements/Cells | 39000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | AEC-Q100 | Total RAM Bits | 1548288 |
Overview of LFD2NX-40-7MG121A – Certus™-NX FPGA, 39k logic elements, ~1.55 Mbits RAM, 71 I/Os, 121‑VFBGA (Automotive AEC‑Q100)
The LFD2NX-40-7MG121A is a Certus™-NX field programmable gate array from Lattice Semiconductor Corporation, provided in a 121‑VFBGA/CSP BGA package. It combines a mid-range logic fabric with embedded RAM and flexible I/O count to address designs requiring moderate logic density, compact packaging and automotive-grade reliability.
With 39,000 logic elements, approximately 1.55 Mbits of on-chip RAM and 71 general-purpose I/Os, this device is suited for applications that demand reconfigurable logic, controlled power operation and operation across a wide temperature range.
Key Features
- Core Logic 39,000 logic elements provide the programmable resources for implementing custom digital functions, accelerators and glue logic.
- Embedded Memory Approximately 1.55 Mbits of on-chip RAM supports buffering, FIFOs and local data storage for state machines and data-paths.
- I/O Capability 71 I/Os available for interfacing with sensors, peripherals and external logic devices, enabling flexible system integration.
- Power Supply Operates from a core voltage supply range of 0.95 V to 1.05 V, allowing designers to plan power budgeting and regulator selection precisely.
- Package and Mounting Supplied in a 121‑VFBGA (supplier package: 121‑CSFBGA, 6×6) surface‑mount package for compact board-level integration.
- Automotive Qualification & Temperature Range Automotive grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C, supporting demanding thermal environments.
- RoHS Compliant Conforms to RoHS requirements for use in lead‑free assemblies.
Typical Applications
- Automotive Control Systems AEC‑Q100 qualification and the −40 °C to 125 °C range make this FPGA suited for vehicle control modules and sensor interface logic where reconfigurable processing is needed.
- Harsh-Environment Embedded Systems Extended temperature range and automotive grade make it appropriate for embedded electronics operating in challenging thermal conditions.
- Compact, High-Integration Designs The 121‑VFBGA CSP package and moderate logic/memory balance suit space-constrained boards that require programmable logic and local RAM.
Unique Advantages
- Automotive‑Grade Reliability: AEC‑Q100 qualification and automotive grade designation provide confidence for vehicle and other high-reliability applications.
- Balanced Logic and Memory: 39,000 logic elements paired with roughly 1.55 Mbits of RAM supports a wide range of mid-complexity functions without external memory.
- Predictable Power Requirements: A narrow core supply range (0.95–1.05 V) simplifies power-rail design and regulator selection for stable operation.
- High I/O Count in a Small Package: 71 I/Os in a 121‑VFBGA (6×6 CSP BGA) footprint enable dense board integration while retaining flexible connectivity.
- RoHS Compliance: Suitable for modern lead‑free manufacturing flows.
Why Choose LFD2NX-40-7MG121A?
The LFD2NX-40-7MG121A positions itself as a compact, automotive‑qualified FPGA that balances programmable logic density and on‑chip memory for mid‑complexity designs. Its combination of 39,000 logic elements, approximately 1.55 Mbits of embedded RAM and 71 I/Os in a small CSP BGA package addresses designers who need reconfigurable logic in thermally demanding and reliability‑sensitive environments.
This device is especially appropriate for engineers developing automotive control electronics and other embedded systems that require AEC‑Q100 qualification, a defined core voltage envelope, and a broad operating temperature range—delivering a practical mix of integration, predictable power characteristics and packaging for long‑term deployment.
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