LFE5U-12F-8BG256C

IC FPGA 197 I/O 256CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 256-LFBGA

Quantity 408 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O197Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3000Number of Logic Elements/Cells12000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of LFE5U-12F-8BG256C – ECP5 FPGA, approximately 12,000 logic elements, 256‑LFBGA

The LFE5U-12F-8BG256C is an ECP5 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor, supplied in a 256‑LFBGA package (supplier package: 256‑CABGA, 14×14). This surface‑mount commercial‑grade FPGA provides substantial on‑chip logic and memory resources with an I/O‑dense pinout suitable for designs that require programmable fabric combined with flexible I/O and clocking features described in the ECP5 family datasheet.

Key attributes include approximately 12,000 logic elements, approximately 0.59 Mbits of embedded RAM (589,824 bits), and up to 197 I/O pins. The device operates from a core supply range of 1.045 V to 1.155 V and supports a commercial operating temperature range of 0 °C to 85 °C. The ECP5 family datasheet documents additional architecture-level features such as programmable I/O cells, PLL/DLL clock resources, DDR memory support, SERDES/PCS blocks, and on‑chip configuration options.

Key Features

  • Logic Capacity  Approximately 12,000 logic elements for implementing mid-density programmable logic and custom peripheral functions.
  • Embedded Memory  Total on‑chip RAM of 589,824 bits (approximately 0.59 Mbits) for buffering, FIFOs, and small on‑chip data storage.
  • I/O Density  Up to 197 I/O pins provide flexibility for parallel interfaces, multiple I/O standards and board-level connectivity.
  • Package and Mounting  256‑LFBGA package (supplier device package: 256‑CABGA, 14×14); surface mount package for compact PCB integration.
  • Power and Voltage  Core supply voltage specified from 1.045 V to 1.155 V to match narrow core‑rail requirements.
  • Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Family Architecture (per ECP5 datasheet)  ECP5 family features include programmable I/O cells, clocking structures (PLLs, clock dividers), DDR memory support, SERDES and PCS blocks, on‑chip oscillator options, and boundary‑scan testability as documented in the family datasheet.
  • Regulatory  RoHS compliant.

Typical Applications

  • High‑density I/O bridging  Use the device’s 197 I/O pins and programmable I/O cells to implement protocol bridging, bus aggregation, or custom interface logic on compact PCBs.
  • Memory interface and buffering  Leverage on‑chip RAM and documented DDR memory support in the ECP5 family datasheet for buffering, temporary storage, and memory controller logic.
  • Serial/PHY functions  Employ SERDES and PCS features described in the family datasheet to implement high‑speed serial links and physical coding sublayer functions.

Unique Advantages

  • Balanced logic and memory ratio  Approximately 12,000 logic elements paired with ~0.59 Mbits of embedded RAM supports a wide range of mid‑density logic designs with on‑chip data storage.
  • I/O‑rich package  197 available I/O pins in a compact 256‑LFBGA package enables dense external interfacing without large package footprints.
  • Tight core voltage spec  The specified 1.045 V to 1.155 V core supply range allows precise power budgeting for designs using narrow core rails.
  • Commercial temperature suitability  Rated for 0 °C to 85 °C for mainstream electronics and industrial‑adjacent applications that operate within this range.
  • Family‑level architecture  Access to ECP5 family features such as programmable I/O, PLL/DLL clocking, DDR support and SERDES/PCS (as documented in the datasheet) simplifies integration of common system functions.
  • RoHS compliance  Environmentally compliant for applications requiring lead‑free components.

Why Choose LFE5U-12F-8BG256C?

The LFE5U-12F-8BG256C is positioned for designers who need a mid‑density, I/O‑capable FPGA in a compact 256‑LFBGA package. Its balance of approximately 12,000 logic elements, roughly 0.59 Mbits of embedded RAM, and 197 I/O pins makes it well suited to designs that require moderate on‑chip logic, localized memory, and extensive external interfacing while operating from a narrow core supply rail.

Backed by the ECP5 family architecture documented in the Lattice datasheet, this device provides documented clocking, memory and serial interface resources that help reduce external component count and consolidate logic into a single programmable device for cleaner BOMs and tighter PCB layouts.

Request a quote or submit an RFQ to obtain pricing and availability for LFE5U-12F-8BG256C.

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