LFE5U-12F-8BG256I

IC FPGA 197 I/O 256CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 256-LFBGA

Quantity 455 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O197Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3000Number of Logic Elements/Cells12000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of LFE5U-12F-8BG256I – ECP5 Field Programmable Gate Array (FPGA)

The LFE5U-12F-8BG256I is an industrial‑grade FPGA in Lattice Semiconductor’s ECP5 family. It delivers a mid-range programmable fabric with 12,000 logic elements, approximately 0.59 Mbits of embedded memory and up to 197 I/O for designs that require flexible interfacing and moderate on‑chip resources.

Built for surface‑mount assembly in a compact 256‑LFBGA (256‑CABGA, 14×14) package, this device targets embedded systems and industrial applications that need a balance of logic capacity, on‑chip memory and dependable operating range.

Key Features

  • Logic Capacity  12,000 logic elements provide mid-range programmable logic suitable for protocol bridging, control logic and custom accelerators.
  • Embedded Memory  Approximately 0.59 Mbits of on‑chip RAM for frame buffering, FIFOs and small lookup tables.
  • I/O Resources  197 I/O pins offer extensive connectivity options for parallel busses, off‑chip interfaces and board-level signals.
  • Power and Supply  Supported core supply range from 1.045 V to 1.155 V to match system power domains and ensure reliable core operation.
  • Package & Mounting  256‑LFBGA (256‑CABGA, 14×14) surface‑mount package for compact board integration.
  • Industrial Temperature Grade  Operating range from −40°C to 100°C suitable for industrial environments and extended temperature deployments.
  • ECP5 Family Architecture  Includes architecture elements described in the ECP5 family datasheet such as a dedicated clocking structure (sysCLOCK PLL), programmable I/O cells with on‑chip programmable termination, DDR memory support and SERDES/PCS capabilities for serial connectivity.
  • Configuration & Reliability  Family-level device configuration features and boundary‑scan testability are provided as described in the ECP5 data sheet to simplify board bring‑up and manufacturing test.
  • Standards & Compliance  RoHS‑compliant material status for regulatory and assembly compatibility.

Typical Applications

  • Industrial Control  Implement control logic, motor drive interfacing and machine I/O aggregation using the device’s logic capacity and industrial temperature rating.
  • Communications & Networking  Use the on‑chip memory and SERDES/PCS features from the ECP5 family to build protocol converters, packet buffering and interface bridging.
  • Embedded Processing & Peripherals  Integrate custom accelerators, peripheral controllers and glue logic where compact packaging and moderate on‑chip RAM are required.
  • Test & Measurement  Deploy in instrumentation front ends that benefit from wide I/O counts and stable operation across −40°C to 100°C.

Unique Advantages

  • Mid‑Range, Practical Logic Capacity: 12,000 logic elements provide a balance of density for common embedded and industrial tasks without the overhead of larger FPGAs.
  • Compact Package Integration: The 256‑LFBGA (14×14) package enables space‑constrained board designs while maintaining substantial I/O.
  • Robust Operating Range: Industrial temperature rating (−40°C to 100°C) supports deployment in harsh or uncontrolled environments.
  • Comprehensive I/O: 197 I/Os accommodate multiple interfaces and enable flexible system partitioning between FPGA and external devices.
  • Family‑Level Feature Set: Access to ECP5 family capabilities such as programmable I/O cells, clocking PLLs, DDR support and SERDES/PCS improves design flexibility and feature integration.
  • Regulatory Compatibility: RoHS compliance simplifies material selection and assembly across global supply chains.

Why Choose LFE5U-12F-8BG256I?

The LFE5U-12F-8BG256I positions itself as a practical, industrial‑grade FPGA option within the ECP5 family for engineers who need a compact, reliable programmable device with substantial I/O and mid‑range logic and memory resources. Its combination of 12,000 logic elements, approximately 0.59 Mbits of embedded RAM and 197 I/O lines makes it well suited for embedded control, interface bridging and communications tasks where board space and operating temperature range matter.

Choosing this device means leveraging the ECP5 family’s architecture and configuration features to accelerate development while maintaining a clear upgrade path within the family for future designs. Its surface‑mount 256‑LFBGA packaging and RoHS compliance support streamlined manufacturing and integration into industrial product lines.

Request a quote or submit an inquiry for pricing, lead time and availability for the LFE5U-12F-8BG256I. Technical sales and distribution channels can provide volume pricing and sourcing information to support your design cycle.

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