LFE5U-25F-6BG381I
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192 24000 381-FBGA |
|---|---|
| Quantity | 294 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 197 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 24000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1032192 |
Overview of LFE5U-25F-6BG381I – ECP5 Field Programmable Gate Array (FPGA), 24,000 logic elements, 381‑FBGA
The LFE5U-25F-6BG381I is a field programmable gate array (FPGA) from Lattice Semiconductor’s ECP5 family. It implements the ECP5 family architecture described in the Lattice datasheet, providing programmable logic, embedded memory, DSP resources and flexible I/O building blocks for mid‑range FPGA designs.
With approximately 24,000 logic elements, roughly 1.03 Mbits of embedded RAM, 197 user I/Os and industrial operating range, this device addresses designs that require moderate logic density, substantial on‑chip memory and a large I/O count in a compact surface‑mount FBGA package.
Key Features
- Core Logic Approximately 24,000 logic elements for implementing custom logic, glue logic and moderate-complexity state machines.
- Embedded Memory Approximately 1.03 Mbits of embedded RAM (1,032,192 total RAM bits) for data buffering, FIFOs and local storage.
- I/O Resources 197 user I/Os supported; programmable I/O cell and sysI/O buffer capabilities are included at the family level.
- DSP and High‑Speed Blocks ECP5 family architecture includes sysDSP slices and SERDES / Physical Coding Sublayer blocks for DSP and serial interface tasks as described in the datasheet.
- Clocking and Timing Flexible clocking architecture with PLLs and dedicated clock distribution as provided by the ECP5 family.
- Package & Mounting 381‑FBGA (supplier package: 381‑CABGA, 17×17) in a surface‑mount form factor for compact board designs.
- Power Core supply operation specified between 1.045 V and 1.155 V.
- Temperature & Grade Industrial grade, rated for operation from −40 °C to 100 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Leverages the industrial temperature range and high I/O count for sensor interfacing, actuator control logic and embedded control functions.
- Interface Bridging & I/O Expansion Large number of I/Os and on‑chip memory make the device suitable for protocol bridging, bus consolidation and peripheral aggregation tasks.
- Networking & Serial Connectivity ECP5 family SERDES and programmable I/O capabilities support high‑speed serial links and physical layer processing described in the datasheet.
- Embedded Systems On‑chip RAM and DSP resources enable local buffering, data manipulation and custom compute functions in space‑constrained systems.
Unique Advantages
- Balanced logic and memory resources: Approximately 24,000 logic elements combined with ~1.03 Mbits of RAM provide a mid‑range capacity for a wide range of embedded tasks.
- High I/O density: 197 user I/Os enable direct connection to numerous peripherals, sensors and external interfaces without extensive external glue logic.
- Industrial operation: Rated from −40 °C to 100 °C, offering suitability for industrial environments and harsher operating conditions.
- Family-level high‑speed and memory features: ECP5 family architecture includes DDR memory support, SERDES blocks, PLLs and sysDSP slices as described in the datasheet, enabling complex interface and signal processing implementations.
- Compact BGA packaging: 381‑FBGA (17×17) surface‑mount package supports compact board layouts while providing access to a large number of I/Os.
- Controlled power rails: Narrow core supply range (1.045 V to 1.155 V) simplifies core power domain design and regulation requirements.
Why Choose LFE5U-25F-6BG381I?
The LFE5U-25F-6BG381I positions itself as a mid‑range ECP5 family FPGA that combines a substantial logic element count with meaningful on‑chip memory and a high I/O count in a compact 381‑FBGA package. Its industrial temperature rating and family‑level support for DDR, SERDES and DSP resources make it appropriate for embedded and industrial designs that require programmable logic, serial interfaces and local data storage.
Designers and procurement teams seeking a compact, RoHS‑compliant FPGA with predictable voltage and temperature specifications will find this device appropriate for a range of control, interface and embedded processing applications. Use the LFE5U-25F-6BG381I where moderate logic density, significant I/O and on‑chip RAM are key selection criteria.
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