LFE5U-25F-6BG381I

IC FPGA 197 I/O 381CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192 24000 381-FBGA

Quantity 294 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package381-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case381-FBGANumber of I/O197Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells24000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of LFE5U-25F-6BG381I – ECP5 Field Programmable Gate Array (FPGA), 24,000 logic elements, 381‑FBGA

The LFE5U-25F-6BG381I is a field programmable gate array (FPGA) from Lattice Semiconductor’s ECP5 family. It implements the ECP5 family architecture described in the Lattice datasheet, providing programmable logic, embedded memory, DSP resources and flexible I/O building blocks for mid‑range FPGA designs.

With approximately 24,000 logic elements, roughly 1.03 Mbits of embedded RAM, 197 user I/Os and industrial operating range, this device addresses designs that require moderate logic density, substantial on‑chip memory and a large I/O count in a compact surface‑mount FBGA package.

Key Features

  • Core Logic  Approximately 24,000 logic elements for implementing custom logic, glue logic and moderate-complexity state machines.
  • Embedded Memory  Approximately 1.03 Mbits of embedded RAM (1,032,192 total RAM bits) for data buffering, FIFOs and local storage.
  • I/O Resources  197 user I/Os supported; programmable I/O cell and sysI/O buffer capabilities are included at the family level.
  • DSP and High‑Speed Blocks  ECP5 family architecture includes sysDSP slices and SERDES / Physical Coding Sublayer blocks for DSP and serial interface tasks as described in the datasheet.
  • Clocking and Timing  Flexible clocking architecture with PLLs and dedicated clock distribution as provided by the ECP5 family.
  • Package & Mounting  381‑FBGA (supplier package: 381‑CABGA, 17×17) in a surface‑mount form factor for compact board designs.
  • Power  Core supply operation specified between 1.045 V and 1.155 V.
  • Temperature & Grade  Industrial grade, rated for operation from −40 °C to 100 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Leverages the industrial temperature range and high I/O count for sensor interfacing, actuator control logic and embedded control functions.
  • Interface Bridging & I/O Expansion  Large number of I/Os and on‑chip memory make the device suitable for protocol bridging, bus consolidation and peripheral aggregation tasks.
  • Networking & Serial Connectivity  ECP5 family SERDES and programmable I/O capabilities support high‑speed serial links and physical layer processing described in the datasheet.
  • Embedded Systems  On‑chip RAM and DSP resources enable local buffering, data manipulation and custom compute functions in space‑constrained systems.

Unique Advantages

  • Balanced logic and memory resources: Approximately 24,000 logic elements combined with ~1.03 Mbits of RAM provide a mid‑range capacity for a wide range of embedded tasks.
  • High I/O density: 197 user I/Os enable direct connection to numerous peripherals, sensors and external interfaces without extensive external glue logic.
  • Industrial operation: Rated from −40 °C to 100 °C, offering suitability for industrial environments and harsher operating conditions.
  • Family-level high‑speed and memory features: ECP5 family architecture includes DDR memory support, SERDES blocks, PLLs and sysDSP slices as described in the datasheet, enabling complex interface and signal processing implementations.
  • Compact BGA packaging: 381‑FBGA (17×17) surface‑mount package supports compact board layouts while providing access to a large number of I/Os.
  • Controlled power rails: Narrow core supply range (1.045 V to 1.155 V) simplifies core power domain design and regulation requirements.

Why Choose LFE5U-25F-6BG381I?

The LFE5U-25F-6BG381I positions itself as a mid‑range ECP5 family FPGA that combines a substantial logic element count with meaningful on‑chip memory and a high I/O count in a compact 381‑FBGA package. Its industrial temperature rating and family‑level support for DDR, SERDES and DSP resources make it appropriate for embedded and industrial designs that require programmable logic, serial interfaces and local data storage.

Designers and procurement teams seeking a compact, RoHS‑compliant FPGA with predictable voltage and temperature specifications will find this device appropriate for a range of control, interface and embedded processing applications. Use the LFE5U-25F-6BG381I where moderate logic density, significant I/O and on‑chip RAM are key selection criteria.

Request a quote or submit a procurement inquiry to obtain pricing, availability and lead‑time information for the LFE5U-25F-6BG381I.

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