LFE5U-25F-6BG381C

The LFE5U-25F-6BG381C is a commercial-grade FPGA from the ECP5 family by Lattice Semiconductor Corporation. It provides a balance of programmable logic, embedded memory, and high I/O density in a compact 381-FBGA package for surface-mount applications.

Designed for embedded and system-level roles such as protocol bridging, custom I/O aggregation, and on-chip signal processing, this device targets designs that require approximately 24,000 logic elements, significant on-chip RAM, and near-200 I/O pins while operating within a commercial temperature and low-voltage core range.

Key Features

• Core Logic  Approximately 24,000 logic elements provide the programmable fabric for combinational and sequential logic implementation.
• Embedded Memory  Approximately 1.03 Mbits of on-chip RAM (1,032,192 bits) for buffering, FIFOs, and on-chip data storage.
• I/O and Interfaces  197 user I/O pins support dense peripheral connectivity and signal routing for system interfaces and external devices.
• Family Architecture  Member of the ECP5 family, with architecture and features described in the ECP5 family data sheet (sysDSP, SERDES, DDR support and programmable I/O blocks referenced in the family documentation).
• Power and Voltage  Core supply operating in the range of 1.045 V to 1.155 V for low-voltage system integration.
• Package and Mounting  381-FBGA package (supplier device package: 381-CABGA, 17×17) suitable for surface-mount assembly and compact board layouts.
• Operating Range  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant.

Typical Applications

• Interface and Protocol Bridging  Use the programmable I/O and logic resources to implement protocol conversion, bus bridging, and custom interface glue logic.
• Packet and Data Buffering  On-chip RAM can be used for packet buffering, small FIFOs, and temporary storage in network or data-path subsystems.
• Signal Processing and Control  Leverage the ECP5 family architecture for timing-critical control, finite-state machines, and custom signal-processing functions.
• High-Density I/O Aggregation  The nearly 200 I/O pins support aggregation of multiple peripherals, sensor interfaces, or expansion headers in compact systems.

Unique Advantages

• Balanced Logic and Memory: Approximately 24,000 logic elements and ~1.03 Mbits of embedded RAM enable mixed logic-plus-buffer designs without external memory for many use cases.
• High I/O Count: 197 I/O pins provide flexibility to connect multiple external interfaces and peripherals directly to the FPGA fabric.
• Compact FBGA Package: The 381-FBGA (381-CABGA, 17×17) package delivers a space-efficient footprint for board-level integration.
• Low-Voltage Core: Narrow core supply window (1.045–1.155 V) supports low-power system designs with consistent voltage requirements.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation, aligning with a wide range of embedded and consumer applications.
• RoHS Compliant: Meets common environmental compliance needs for modern electronics manufacturing.

Why Choose LFE5U-25F-6BG381C?

The LFE5U-25F-6BG381C positions itself as a capable, commercially rated FPGA option within the Lattice ECP5 family, providing a practical mix of logic, embedded memory, and high I/O density in a compact surface-mount FBGA package. Its documented family architecture supports common FPGA use cases such as programmable I/O, memory-centric designs, and serial/parallel interface handling.

Choose this device when your design requires approximately 24,000 logic elements, around 1.03 Mbits of on-chip RAM, and up to 197 I/Os in a 381-FBGA form factor with RoHS compliance and commercial-temperature operation. It is well suited for engineers and procurement teams building compact, low-voltage embedded systems that depend on programmable logic and local memory resources.

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