LFE5U-25F-6BG256C

The LFE5U-25F-6BG256C is an ECP5 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides 24,000 logic elements and approximately 1.03 Mbits of embedded memory in a compact 256‑LFBGA package.

Targeted at commercial-grade applications, this surface-mount FPGA offers 197 I/Os, a core supply range of 1.045 V to 1.155 V, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and packaged as a 256‑CABGA (14×14) footprint.

Key Features

• Core Logic  24,000 logic elements for implementing control logic, interface glue, and mid-density FPGA functions.
• Embedded Memory  Total RAM bits: 1,032,192 (approximately 1.03 Mbits) to support on-chip buffering and state storage.
• I/O Capacity  197 user I/Os to support multiple parallel interfaces and signal-rich designs.
• Power and Voltage  Core voltage supply range of 1.045 V to 1.155 V for predictable power planning.
• Package & Mounting  256‑LFBGA (256‑CABGA, 14×14) in a surface-mount form factor suited for automated PCB assembly.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant for environmental and manufacturing conformity.
• ECP5 Family Architecture  Part of the ECP5 family; the ECP5 family data sheet documents programmable I/O cells, clocking structures, memory blocks, SERDES and other architecture elements.

Typical Applications

• Interface Bridging and Protocol Conversion  Use the device’s logic capacity and 197 I/Os to implement protocol translators and bus bridges between subsystems.
• Embedded Control and State Machines  On-chip logic and memory enable implementation of real-time control, sequencing, and finite-state machines for commercial products.
• I/O Aggregation and Board-Level Glue  High pin count and embedded memory make the part suitable for consolidating multiple I/O functions and reducing external components.
• Prototyping and Development Platforms  Compact 256‑LFBGA packaging and surface-mount compatibility support prototype and production PCB designs in the commercial temperature range.

Unique Advantages

• High logic density in a compact package: 24,000 logic elements within a 256‑LFBGA package minimizes board area for mid-density FPGA implementations.
• Substantial on-chip memory: Approximately 1.03 Mbits of embedded RAM reduces the need for some external memory, simplifying BOM and layout.
• Extensive I/O: 197 I/Os provide flexibility for multi-interface designs and parallel signal requirements.
• Predictable core power envelope: Narrow core supply range (1.045 V–1.155 V) assists in power supply selection and thermal planning.
• Commercial-ready and RoHS compliant: Rated for 0 °C to 85 °C and RoHS compliant for mainstream product applications.
• Surface-mount 256‑CABGA footprint: Standard 14×14 package facilitates automated assembly and compact board layouts.

Why Choose LFE5U-25F-6BG256C?

The LFE5U-25F-6BG256C balances logic capacity, on-chip memory, and I/O density in a compact surface-mount package, making it suitable for commercial embedded systems that require moderate to high logic integration and multiple interfaces. Its defined core voltage range and commercial operating temperature simplify power and thermal design decisions.

As a member of the ECP5 family from Lattice Semiconductor Corporation, this part aligns with the ECP5 architecture documented in the family data sheet, providing a solution for designers who need a mid-density FPGA with substantial I/O and embedded memory in a 256‑LFBGA form factor.

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