LFE5U-85F-6BG554C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 259 3833856 84000 554-FBGA |
|---|---|
| Quantity | 117 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 554-CABGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 554-FBGA | Number of I/O | 259 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21000 | Number of Logic Elements/Cells | 84000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFE5U-85F-6BG554C – ECP5 Field Programmable Gate Array (FPGA) IC, 259 I/O, ~3.83 Mbits RAM, 84,000 logic elements, 554‑FBGA
The LFE5U-85F-6BG554C is a commercial‑grade member of the ECP5 FPGA family from Lattice Semiconductor Corporation. It provides a mid‑density programmable fabric with 84,000 logic elements, approximately 3.83 Mbits of embedded RAM, and 259 user I/O pins in a 554‑ball FBGA package.
Designed for applications that require flexible I/O, on‑chip memory, and integrated FPGA architecture features referenced in the ECP5 family data sheet (clocking, programmable I/O, DDR support, SERDES/PCS and device configuration), this device targets a range of embedded and communications designs where integration and predictable operating conditions matter.
Key Features
- Logic Capacity — 84,000 logic elements (cells) to implement combinational and sequential logic for mid‑range FPGA designs.
- Embedded Memory — Approximately 3.83 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage.
- I/O Resources — 259 user I/O pins to accommodate wide buses, multiple interfaces, and complex board‑level connectivity.
- Programmable Fabric & Architecture — Based on the ECP5 family architecture with documented features including slices, routing, clocking structures (sysCLOCK PLL and distributed clock network), programmable I/O cells, DDR memory support, and SERDES/PCS blocks.
- Package & Mounting — 554‑FBGA (supplier package: 554‑CABGA, 23 × 23 mm) in a surface‑mount form factor for compact PCB layouts.
- Power & Operating Range — Core supply range specified from 1.045 V to 1.155 V; designed to operate in commercial temperature range from 0 °C to 85 °C.
- Manufacturing & Environmental — RoHS compliant and supplied by Lattice Semiconductor Corporation as a commercial‑grade device.
Typical Applications
- Communications & Protocol Bridging — High I/O count and documented SERDES/PCS and programmable I/O support make this device suitable for implementing protocol conversion, interface bridging, and packet processing logic.
- Embedded Systems — On‑chip memory and flexible logic resources enable local buffering, custom peripheral integration, and control functions in embedded controllers and appliances.
- Video & Imaging Front‑Ends — The combination of abundant I/O and embedded RAM supports frame buffering, data alignment, and pre‑processing tasks in video capture and distribution modules.
- Industrial Automation — Deterministic programmable logic and wide I/O availability support motor control interfaces, sensor aggregation, and machine control functions within the commercial temperature range.
Unique Advantages
- Balanced Integration: Combines a sizable logic capacity (84,000 logic elements) with multi‑Mbit on‑chip memory for designs that need both compute and storage on a single device.
- High I/O Density: 259 user I/O pins simplify board routing for wide buses and multiple external interfaces, reducing the need for external glue logic.
- Family Feature Set: Leverages documented ECP5 family features—clocking infrastructure, programmable I/O, DDR support, and SERDES/PCS blocks—so designers can use established architecture capabilities from the datasheet.
- Compact Package: 554‑FBGA (23 × 23 mm) surface‑mount package enables compact PCB implementations while preserving connectivity and thermal footprint.
- Commercial Availability: Commercial grade device with RoHS compliance suitable for a wide range of mainstream electronic products operating between 0 °C and 85 °C.
Why Choose LFE5U-85F-6BG554C?
The LFE5U-85F-6BG554C positions itself as a flexible, mid‑density FPGA option within the ECP5 family, offering a practical balance of logic capacity, embedded memory, and high I/O count in a compact 554‑FBGA package. It is well suited to designers who need on‑chip RAM and substantial I/O resources while relying on the documented architectural features of the ECP5 family.
For teams developing communications, embedded control, video front‑ends, or automation equipment within commercial temperature and supply constraints, this device delivers integrated resources and predictable electrical characteristics as specified by the manufacturer.
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