LFE5U-85F-6BG554I

The LFE5U-85F-6BG554I is an ECP5-series Field Programmable Gate Array (FPGA) from Lattice Semiconductor supplied in a 554‑FBGA package. This device provides a combination of high logic density, substantial on‑chip memory, and a large I/O count for compact, programmable hardware designs.

Targeted for industrial applications, the device delivers up to 84,000 logic elements, approximately 3.83 Mbits of embedded RAM, and up to 259 I/O while supporting an operating temperature range of −40 °C to 100 °C and a core supply of 1.045 V to 1.155 V.

Key Features

• Core Logic — 84,000 logic elements provide capacity for complex programmable logic implementations.
• Embedded Memory — Approximately 3.83 Mbits of on‑chip RAM for buffering, local storage, and state machines.
• I/O Density — Up to 259 programmable I/O pins to support diverse peripheral and interface requirements.
• Package & Mounting — Supplied in a 554‑FBGA (554‑CABGA, 23×23) surface‑mount package for high pin count in a compact footprint.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for extended temperature deployments.
• Core Voltage — 1.045 V to 1.155 V supply range for the device core.
• ECP5 Family Architecture — Built on the ECP5 family architecture with documented features including programmable routing, clocking (sysCLOCK PLL), sysDSP slices, SERDES, DDR memory support and on‑chip oscillator as described in the family datasheet.
• Regulatory — RoHS‑compliant.

Typical Applications

• Industrial Control — Industrial deployments that require extended temperature operation (−40 °C to 100 °C) combined with programmable logic and sizable I/O counts.
• High‑I/O Embedded Systems — Systems that benefit from up to 259 I/O and 84,000 logic elements to consolidate interface logic and reduce external components.
• Memory‑Intensive Logic Functions — Designs requiring local buffering or on‑chip storage can leverage approximately 3.83 Mbits of embedded memory.

Unique Advantages

• High logic density: Large logic element count enables consolidation of complex functions onto a single FPGA.
• Substantial on‑chip memory: Approximately 3.83 Mbits of RAM reduces reliance on external memory for many designs.
• Broad I/O capability: 259 I/O pins support diverse peripheral interfaces and signal routing needs.
• Industrial reliability: Extended operating temperature rating supports deployment in demanding environments.
• Compact, high‑pin package: 554‑FBGA / 554‑CABGA (23×23) offers high pin density for space‑constrained PCBs.
• Family feature set: Leverages ECP5 family architecture elements (DSP slices, SERDES, PLLs, DDR support) for flexible system integration as documented in the datasheet.
• Controlled core supply: Narrow core voltage range (1.045–1.155 V) supports stable power‑domain design.

Why Choose LFE5U-85F-6BG554I?

The LFE5U-85F-6BG554I combines a high logic element count, significant embedded memory, and a large I/O complement in a compact 554‑FBGA surface‑mount package suitable for industrial environments. Built on the ECP5 family architecture, the device benefits from documented capabilities such as DSP slices, SERDES, flexible clocking and DDR memory support to address a wide range of programmable logic needs.

Choose this device when your design requires substantial on‑chip resources, robust I/O capacity, and industrial temperature operation with the integration advantages afforded by the ECP5 family architecture.

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