LFE5U-85F-6BG756I

The LFE5U-85F-6BG756I is an ECP5 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a mid-to-high density FPGA fabric with 84,000 logic elements and approximately 3.8 Mbits of on-chip RAM, delivered in a 756-CABGA (27×27) surface-mount package.

Designed for industrial-grade operation (–40 °C to 100 °C) and a wide set of on-chip resources documented for the ECP5 family, this device targets applications that require significant logic capacity, abundant I/O, and integrated memory and SERDES/clocking resources.

Key Features

• Logic Capacity — 84,000 logic elements provide substantial programmable fabric for combinational and sequential logic implementation.
• Embedded Memory — Total RAM of 3,833,856 bits (approximately 3.8 Mbits) for on-chip data buffering, FIFOs, and small-footprint storage needs.
• I/O Density — 365 general-purpose I/O pins to support wide bus interfaces, parallel peripherals, or multiple serial lanes.
• Package & Mounting — 756-CABGA (27×27) supplier device package in a surface-mount form factor; devices are supplied in tray packaging.
• Industrial Operating Range — Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
• Supply Voltage — Core supply specified at 1.045 V.
• ECP5 Family Architecture — Family-level features documented in the datasheet include programmable I/O blocks, clocking structures (including PLLs), SERDES and PCS blocks, sysDSP slices, DDR memory support, on-chip oscillator, and configuration/test capabilities such as IEEE 1149.1-compliant boundary scan and SEU support.

Typical Applications

• Industrial Control — Industrial-grade temperature range and significant logic/I/O resources make this device suitable for control, motor drive interface, and factory automation functions.
• Communications & Networking — On-die SERDES and PCS blocks (documented for the ECP5 family) plus abundant I/O enable board-level protocol bridging, PHY interfacing, and packet-processing tasks.
• Memory Interface & Bridging — Embedded RAM and DDR memory support in the family enable buffering and interface logic for memory-conversion, buffering, and arbitration roles.
• Signal Processing & Custom Logic — The ECP5 family’s sysDSP slices and programmable fabric provide resources for custom DSP pipelines, filtering, and timing-critical logic functions.

Unique Advantages

• High integration density: 84,000 logic elements and approximately 3.8 Mbits of embedded RAM combine to reduce external component count and simplify board design.
• Extensive I/O capability: 365 I/O pins support broad interfacing options for parallel buses, multiple serial lanes, or mixed-signal front-ends.
• Industrial readiness: Specified operation from –40 °C to 100 °C supports deployment in harsh and industrial environments.
• Compact, manufacturable package: 756-CABGA (27×27) surface-mount package supports dense PCB layouts and standard assembly in tray format.
• Family-level system resources: Documented ECP5 family features such as PLL-based clocking, SERDES/PCS blocks, DDR support, on-chip oscillator, and boundary-scan testability enable complex system designs with integrated timing and I/O options.

Why Choose LFE5U-85F-6BG756I?

The LFE5U-85F-6BG756I positions itself as a versatile mid-to-high density FPGA option within the ECP5 family, offering a balance of logic capacity, embedded memory, and I/O count in a compact 756-CABGA package. Its industrial temperature rating and family-level resources documented in the datasheet make it suitable for applications that require reliable operation and integrated SERDES, DSP, and memory interfaces.

This device is appropriate for engineers designing systems that need scalable programmable logic, substantial on-chip RAM, and broad I/O connectivity while maintaining an industrial operating envelope backed by Lattice Semiconductor Corporation’s ECP5 family documentation.

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