LFE5U-85F-7BG554I

The LFE5U-85F-7BG554I is an ECP5 family field programmable gate array supplied in a 554‑ball FBGA (554‑CABGA, 23×23) package. It delivers 84,000 logic elements, approximately 3.83 Mbits of embedded RAM, and up to 259 I/Os in a surface‑mount industrial‑grade device designed for system and board designers who need a programmable, high‑density logic fabric.

Family documentation for the ECP5 series details on‑chip resources including programmable I/O cells, SERDES, DDR memory support, sysDSP slices and PLL clocking, making this device suitable for designs that require configurable logic, memory interfacing and high‑density I/O in an industrial temperature range.

Key Features

• Logic Capacity 84,000 logic elements for implementing complex digital logic, control functions and custom accelerators.
• Embedded Memory Approximately 3.83 Mbits of on‑chip RAM for buffering, FIFOs and local data storage.
• I/O Resources Up to 259 programmable I/Os suitable for broad peripheral and bus interfacing requirements.
• Package and Mounting 554‑FBGA (554‑CABGA, 23×23) surface‑mount package for high‑density board integration.
• Power Supply Range Core voltage operating range from 1.045 V to 1.155 V for the device core supply.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for industrial environments.
• Standards & Compliance RoHS compliant.
• Family‑Level Architecture ECP5 family documentation describes programmable I/O cells, sysCLOCK PLL, sysDSP slices, DDR memory support and SERDES blocks (see datasheet for details).

Typical Applications

• Industrial Control Use the device’s logic density and 259 I/Os for motor control, PLC functions and embedded supervisory logic within industrial temperature ranges.
• Communications and Networking Family features such as SERDES and flexible I/O enable protocol bridging, packet processing and interface adaptation tasks.
• Memory Interface and Storage DDR memory support and abundant on‑chip RAM make the device suitable for buffering, memory controllers and data path implementations.
• Signal Processing sysDSP slice capabilities documented in the family datasheet support implementation of fixed‑function DSP pipelines and custom accelerators.

Unique Advantages

• High Logic Density: 84,000 logic elements allow consolidation of multiple functions into a single device, reducing board count and BOM complexity.
• Substantial Embedded RAM: Approximately 3.83 Mbits of on‑chip memory reduces dependency on external RAM for many buffering and low‑latency data tasks.
• Broad I/O Count: 259 I/Os provide flexibility for parallel interfaces, multiple peripherals and complex board-level connectivity.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in industrial environments without additional thermal qualification notes in the product data.
• Compact, High‑Density Package: 554‑FBGA (23×23) enables space‑efficient placement on modern PCBs while maintaining high pin count.
• Documented Family Features: ECP5 family datasheet lists configurable I/O, PLLs, DDR support, SERDES and DSP resources to help architects map system requirements to device capabilities.

Why Choose LFE5U-85F-7BG554I?

The LFE5U-85F-7BG554I positions itself as a high‑density, industrial‑grade FPGA option within the ECP5 family, offering a balance of logic capacity, embedded memory and extensive I/O in a compact 554‑ball package. Its documented family features—programmable I/O, SERDES, DDR support and DSP slices—provide a practical foundation for applications that require configurable I/O, memory interfacing and signal processing functionality.

This device is well suited to engineers and system designers looking to consolidate functions, accelerate data paths and maintain deployable performance across industrial temperature ranges while relying on the ECP5 family documentation for architecture and implementation guidance.

Request a quote or submit an RFQ to get pricing and availability information for LFE5U-85F-7BG554I and to discuss how this FPGA can fit into your next design.