LFE5U-85F-7BG554C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 259 3833856 84000 554-FBGA |
|---|---|
| Quantity | 835 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 554-CABGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 554-FBGA | Number of I/O | 259 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21000 | Number of Logic Elements/Cells | 84000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFE5U-85F-7BG554C – ECP5 FPGA, approximately 84,000 logic elements, ~3.83 Mbits embedded memory, 259 I/Os, 554‑FBGA
The LFE5U-85F-7BG554C is a commercial‑grade ECP5 Field Programmable Gate Array from Lattice Semiconductor. This device provides approximately 84,000 logic elements, approximately 3.83 Mbits of embedded memory, and up to 259 user I/O in a 554‑FBGA (554‑CABGA, 23×23) surface‑mount package.
As part of the ECP5 family (see the ECP5 family data sheet), the device implements on‑chip features such as dedicated DSP resources, SERDES and physical coding functions, programmable I/O cells, PLL‑based clocking, and DDR memory support, enabling a wide range of logic, data buffering, and high‑I/O applications within a commercial temperature range (0 °C to 85 °C) and a supply range of 1.045 V to 1.155 V.
Key Features
- Core Logic Approximately 84,000 logic elements and 21,000 CLBs providing programmable fabric for complex logic implementation.
- Embedded Memory Approximately 3.83 Mbits of on‑chip RAM for frame buffers, FIFOs, and on‑device data storage.
- I/O and Packaging Up to 259 user I/Os in a 554‑FBGA (554‑CABGA, 23×23) surface‑mount package for high‑pin‑count interconnects.
- Power and Temperature Recommended supply range 1.045 V to 1.155 V; commercial operating temperature 0 °C to 85 °C; RoHS compliant.
- Clocking and Timing Integrated sysCLOCK PLL and a structured clock distribution network as described in the ECP5 family data sheet for flexible clocking schemes.
- Dedicated DSP and SERDES sysDSP slices and SERDES/PCS blocks (documented in the ECP5 family data sheet) for arithmetic and high‑speed serial link functions.
- Memory Interfaces sysMEM blocks and DDR memory support with DQS grouping and calibrated DQS delay/control features documented in the family data sheet.
- Configuration and Reliability Enhanced configuration options, on‑chip oscillator, boundary‑scan testability, and single event upset (SEU) support referenced in the ECP5 family documentation.
Typical Applications
- Network & Communications High I/O count and SERDES/PCS capabilities support physical interfaces and protocol handling in communication equipment.
- Video & Imaging On‑chip DSP slices and approximately 3.83 Mbits of embedded memory enable buffering and real‑time data processing tasks in imaging pipelines.
- Embedded Control (commercial‑grade) Large logic capacity and plentiful I/O make the device suitable for commercial embedded control and automation systems operating within the specified 0 °C to 85 °C range.
- Memory Interface & Buffering sysMEM blocks and DDR support facilitate high‑bandwidth data buffering and memory interface implementations.
Unique Advantages
- Highly integrated programmable fabric: Combines approximately 84,000 logic elements with dedicated DSP and memory blocks to reduce external logic and simplify system architecture.
- High I/O density in a compact package: 259 user I/Os in a 554‑FBGA (23×23) package enable dense board layouts and multiple peripheral interfaces.
- Flexible clocking and timing resources: sysCLOCK PLL and a structured clock distribution network provide configurable clock domains and timing control as described in the family data sheet.
- Built‑in high‑speed and memory support: Integrated SERDES, DDR memory features, and calibrated DQS control support high‑bandwidth serial and parallel memory interfaces.
- Commercial readiness and compliance: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance for standard commercial deployments.
Why Choose LFE5U-85F-7BG554C?
The LFE5U-85F-7BG554C positions itself as a mid‑to‑high density member of the ECP5 family, offering a balance of programmable logic capacity, embedded memory, and high I/O count in a 554‑FBGA package. Its on‑chip DSP slices, SERDES and DDR support, and flexible clocking resources (as detailed in the ECP5 family data sheet) make it a practical choice for designs requiring integrated data processing, interface variety, and substantial logic capacity within a commercial operating envelope.
This device is appropriate for engineers building commercial‑grade systems that need scalable ECP5 family architecture, flexible configuration options, and on‑device resources to minimize external components and streamline board design.
Request a quote or submit a purchasing inquiry today to receive pricing and availability for the LFE5U-85F-7BG554C.

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