LFE5U-85F-7BG756I

The LFE5U-85F-7BG756I is an ECP5 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for industrial-grade embedded logic applications. It combines a high logic capacity with extensive I/O and embedded memory blocks for flexible integration into data, control and communication systems.

This device provides 84,000 logic elements, approximately 3.83 Mbits of embedded memory, and 365 I/O pins in a 756-ball FBGA (27×27) surface-mount package, with a recommended supply range of 1.045 V to 1.155 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity — 84,000 logic elements to implement complex programmable logic, state machines, and custom processing pipelines.
• Embedded Memory — Total on-chip RAM of 3,833,856 bits (approximately 3.83 Mbits) for frame buffering, lookup tables, and register files.
• High I/O Count — 365 user I/O pins to support dense peripheral, bus and sensor interfacing from a single device.
• Package and Mounting — 756-ball FBGA (27×27) surface mount package (supplier device package listed as 756-CABGA), enabling compact PCB layouts and high-pin-density routing.
• Industrial Operating Range — Rated for industrial use with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulatory alignment.
• Power Supply — Narrow core supply window specified at 1.045 V to 1.155 V to support controlled power domains and predictable power budgeting.
• On-chip System Blocks (ECP5 family) — Architecture-level features documented in the ECP5 family datasheet include programmable I/O cells, PLL/sysCLOCK clocking, sysMEM embedded memory blocks, sysDSP slices, DDR memory support, SERDES and physical coding sublayer (PCS), and device configuration options.

Typical Applications

• Industrial Control Systems — Industrial-grade temperature rating and robust I/O count make this FPGA suitable for control and automation applications requiring reliable operation across −40 °C to 100 °C.
• High-density I/O and Interface Bridging — 365 I/Os support sensor aggregation, bus bridging and multi-protocol interface implementations in compact designs.
• Embedded Memory and DSP Acceleration — Approximately 3.83 Mbits of on-chip RAM combined with dedicated DSP-oriented slices (sysDSP) enables local buffering and acceleration for signal processing tasks.
• High-speed Serial and Memory Interfaces — ECP5 family features such as SERDES, DDR memory support and programmable I/O cells support designs that need serial links and external memory interfacing.

Unique Advantages

• Balanced Integration: A combination of 84,000 logic elements, significant embedded RAM and abundant I/O reduces external component count and simplifies system design.
• Industrial-ready Operation: Specified operating range of −40 °C to 100 °C and RoHS compliance support deployment in industrial environments and supply-chain requirements.
• Compact High-pin-count Package: 756-ball FBGA (27×27) package provides high I/O density in a compact footprint for space-constrained PCBs.
• Predictable Power Domain: Narrow core supply range (1.045 V–1.155 V) aids in precise power budgeting and thermal planning for embedded systems.
• Family-level System Features: ECP5 family architecture includes programmable I/O, clocking resources, embedded memory, DSP slices, SERDES and DDR support to address a wide range of interface and processing requirements.

Why Choose LFE5U-85F-7BG756I?

The LFE5U-85F-7BG756I offers a practical balance of logic density, embedded memory and I/O capacity in an industrial-grade FPGA package. Its specifications align with designs that require substantial programmable logic, local RAM for buffering, and a high number of external interfaces while operating across extended temperature ranges.

Designers and procurement teams seeking a compact, surface-mount FPGA with documented ECP5 family system blocks and a defined power and temperature envelope will find this part suitable for long-term deployment in industrial and embedded applications.

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