LFE5U-85F-8BG381C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 205 3833856 84000 381-FBGA |
|---|---|
| Quantity | 300 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 205 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21000 | Number of Logic Elements/Cells | 84000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFE5U-85F-8BG381C – ECP5 FPGA, 84,000 logic elements, 205 I/O, 381‑FBGA
The LFE5U-85F-8BG381C is a Field Programmable Gate Array (FPGA) from the Lattice ECP5 family. It delivers a mid-range, reprogrammable fabric with 84,000 logic elements, approximately 3.83 Mbits of embedded RAM and up to 205 user I/O in a compact 381‑FBGA package.
Designed for commercial applications, this device targets mid-density logic integration, interface bridging and embedded processing tasks where moderate on‑chip memory, a generous I/O count and a small-footprint BGA are required. Operational voltage and temperature bounds are specified for predictable integration into standard commercial designs.
Key Features
- Core logic — 84,000 logic elements to implement combinational and sequential logic for mid-density FPGA designs.
- Embedded memory — Approximately 3.83 Mbits of on‑chip RAM for data buffering, FIFOs and small memory blocks without external DRAM.
- I/O capacity — 205 user I/O pins to support multiple peripheral interfaces, parallel buses and board-level connectivity options.
- Power supply — Nominal core supply range 1.045 V to 1.155 V for core power planning and regulator selection.
- Package and mounting — 381‑FBGA (381‑CABGA, 17×17 mm) package with surface-mount mounting type for compact PCB implementations.
- Operating range — Commercial temperature grade: 0 °C to 85 °C for standard commercial deployments.
- RoHS compliant — Meets RoHS environmental requirements for lead‑free manufacturing and assembly.
- Family-level architecture — Part of the ECP5 family (datasheet available) with documented features such as programmable I/O cells, clocking resources, memory and DSP/SERDES blocks at the family level.
Typical Applications
- Embedded system interfaces — Use the device’s dense I/O and on‑chip RAM to implement protocol bridging, custom peripheral interfaces and board-level glue logic.
- Communications and connectivity — Leverage family-level SERDES and clocking capabilities (as documented for the ECP5 family) to implement physical-layer interfaces and link management.
- Video and imaging pipelines — Deploy the available logic elements and embedded memory to implement capture, buffering and preprocessing functions in compact designs.
- Industrial and commercial controllers — Integrate control logic, sensor aggregation and deterministic I/O handling within the commercial operating temperature range.
Unique Advantages
- Balanced density and I/O: 84,000 logic elements combined with 205 I/O pins provide a strong platform for designs that need moderate logic and broad connectivity without a larger package.
- On‑chip memory reduces BOM: Approximately 3.83 Mbits of embedded RAM lets you implement buffers and small data stores on‑chip, reducing the need for some external memory components.
- Compact BGA footprint: The 381‑FBGA (17×17) package enables high‑density board layouts while keeping a mid‑sized physical profile for space-constrained applications.
- Commercial temperature rating: Rated for 0 °C to 85 °C for reliable operation across typical commercial environments.
- Predictable power planning: Narrow core supply window (1.045 V–1.155 V) simplifies regulator selection and power-domain design.
- Environmental compliance: RoHS compliance supports lead‑free manufacturing and regulatory requirements.
Why Choose LFE5U-85F-8BG381C?
The LFE5U-85F-8BG381C positions itself as a practical mid-density FPGA option within the Lattice ECP5 family, offering a combination of 84,000 logic elements, substantial embedded RAM and a high I/O count in a compact 381‑FBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial embedded designs that require on‑chip memory and significant I/O without moving to larger, higher-density devices.
This device is well suited to designers seeking predictable power and thermal envelopes (specified core voltage range and operating temperature) and who need an FPGA solution that balances logic capacity, memory and I/O in a compact form factor backed by the ECP5 family documentation.
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