LFE5U-85F-8BG554I

The LFE5U-85F-8BG554I is an industrial-grade member of the Lattice ECP5 FPGA family, offering a balanced mix of programmable logic, embedded memory, DSP resources and high-density I/O in a 554-ball FBGA package. It targets applications that require medium-to-high logic capacity, substantial on-chip RAM and a large I/O count while operating across an extended industrial temperature range.

Built on the ECP5 architecture, this device combines programmable logic (21,000 CLBs / 84,000 logic elements), approximately 3.8 Mbits of embedded memory and a flexible I/O and SERDES feature set described in the ECP5 family datasheet, enabling integration of custom interfaces, signal processing and memory subsystems in a single IC.

Key Features

• Core Logic — 21,000 CLBs delivering 84,000 logic elements for implementing medium-to-large combinational and sequential logic designs.
• Embedded Memory — Approximately 3.8 Mbits of on-chip RAM to support frame buffers, FIFOs and local data storage without external SDRAM for many functions.
• I/O Capacity — 259 user I/Os to support multiple parallel interfaces, control signals and board-level connectivity.
• DSP and Processing Blocks — ECP5 family architecture includes sysDSP slices for efficient implementation of arithmetic and signal-processing functions (as detailed in the ECP5 datasheet).
• SERDES and High-Speed Interfaces — Family-level support for SERDES and PCS functionality to enable serial links and physical-layer coding where required.
• Clocking and PLLs — Dedicated clocking resources including sysCLOCK PLL and a structured clock-distribution network for low-jitter, multi-clock designs (per ECP5 family documentation).
• Package and Mounting — 554-FBGA (supplier package 554-CABGA, 23×23 mm) surface-mount package suitable for compact board integration.
• Supply and Temperature — Supported core voltage range 1.045 V to 1.155 V; industrial operating temperature from −40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Implement motor control logic, sensor aggregation and deterministic I/O handling across extended temperature ranges using the device’s industrial-grade specification.
• Communications and Networking — Support protocol bridges, packet processing and serial links using on-chip SERDES, programmable I/O and dedicated clocking resources.
• Video, Imaging and Embedded Vision — Use substantial embedded RAM and DSP resources for frame buffering, preprocessing and custom image pipelines.
• Test & Measurement Equipment — Build flexible front-end interfaces, data capture and real-time processing with ample I/O and logic capacity.

Unique Advantages

• Balanced logic and memory mix: 21,000 CLBs and approximately 3.8 Mbits of embedded RAM let you implement complex logic together with substantial on-chip data storage, reducing dependence on external memory for many functions.
• High I/O density: 259 I/Os provide flexibility for parallel buses, control signals and multiple peripheral interfaces without immediate need for external I/O expanders.
• Industrial operating range: Qualified for −40 °C to 100 °C operation and supplied in a robust FBGA package for reliable performance in industrial environments.
• Family-level system features: ECP5 architecture includes DSP slices, configurable clocking (PLLs and distribution), SERDES and DDR memory support documented in the ECP5 datasheet, allowing reuse of family IP and design flows.
• Compact board footprint: 23×23 mm 554-CABGA package delivers high integration density for space-constrained applications.
• Regulatory friendliness: RoHS compliance supports environmentally conscious manufacturing and assembly requirements.

Why Choose LFE5U-85F-8BG554I?

The LFE5U-85F-8BG554I provides a practical combination of mid-to-high logic capacity, significant on-chip RAM and a large number of user I/Os in an industrial-grade FPGA package. It is suitable for engineers and system designers who need a configurable platform that consolidates logic, memory and interface functions while supporting family-level features such as DSP blocks, SERDES and flexible clocking documented in the ECP5 datasheet.

This part fits designs that require scalable programmability and on-board integration—reducing external component count and enabling compact, robust systems for industrial, communications and imaging applications. The device’s supported voltage range, temperature rating and package make it a straightforward choice where industrial operating conditions and high integration density are priorities.

Request a quote or submit an inquiry for pricing and availability of LFE5U-85F-8BG554I to start integrating this ECP5 device into your next design.