LFE5U-85F-8MG285C

The LFE5U-85F-8MG285C is an ECP5 family Field Programmable Gate Array (FPGA) in a 285-LFBGA (CSPBGA) package. The device provides 84,000 logic elements, approximately 3.83 Mbits of embedded memory, and 118 programmable I/Os, delivering a mid-density, programmable logic solution for commercial embedded designs.

Designed for surface-mount PCB applications, this commercial-grade FPGA operates from a core supply range of 1.045 V to 1.155 V and supports an ambient operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity  84,000 logic elements for implementing moderate to complex digital logic, state machines, and glue logic.
• Embedded Memory  Approximately 3.83 Mbits of on-chip RAM for buffering, packet storage, and local data structures.
• I/O and Interfaces  118 programmable I/Os enabling flexible interfacing to external peripherals and buses; programmable I/O cell and PIO blocks are included in the family architecture.
• Clocking and Timing  Includes sysCLOCK PLL and clock distribution structures documented for the ECP5 family to support synchronized designs and multiple clock domains.
• High-Speed and Memory Support  Family-level features include DDR memory support, DQS control blocks, and SERDES/physical coding sublayer elements as described in the ECP5 datasheet.
• DSP and Memory Blocks  sysDSP slices and sysMEM memory blocks are part of the family architecture to support arithmetic acceleration and memory-intensive logic.
• Package and Mounting  285-LFBGA (CSPBGA) supplier device package: 285-CSFBGA (10×10); surface-mount package suitable for compact board designs.
• Power and Temperature  Core supply voltage range 1.045 V to 1.155 V; rated for commercial operating temperatures from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Interface and Bridge Logic  Programmable I/Os, DDR memory support, and SERDES capabilities make this FPGA suitable for implementing custom interface bridging and protocol adaptation.
• Embedded Control and Acceleration  84,000 logic elements and sysDSP slices support control functions and hardware-accelerated signal processing in embedded systems.
• Data Buffering and Local Memory  Approximately 3.83 Mbits of embedded RAM provides on-chip buffering and storage for packet handling, frame buffering, or intermediate data staging.
• Compact System Integration  The 285-LFBGA package and surface-mount mounting make the device suitable for space-constrained commercial PCBs requiring programmable logic.

Unique Advantages

• Mid-Density Logic with Substantial Memory:  Combines 84,000 logic elements with approximately 3.83 Mbits of RAM to consolidate logic and storage on-chip, reducing external memory needs.
• Comprehensive I/O and Interface Support:  118 programmable I/Os plus documented DDR and SERDES support enable flexible connectivity and high-speed interface implementations.
• Integrated Clocking and DSP Resources:  Built-in PLLs, clock distribution, and sysDSP slices simplify multi-clock designs and accelerate arithmetic-heavy functions.
• Compact, Surface-Mount Package:  285-LFBGA (10×10) package delivers a compact footprint for board-level integration while preserving robust I/O counts.
• Commercial-Grade Specification:  Rated for 0 °C to 85 °C operation and RoHS compliant for general commercial deployments.
• Predictable Core Power Range:  Specified core supply between 1.045 V and 1.155 V supports controlled power planning and supply design.

Why Choose LFE5U-85F-8MG285C?

The LFE5U-85F-8MG285C delivers a balanced combination of logic density, embedded memory, and I/O flexibility in a compact 285-LFBGA package. Its documented family features—including programmable I/O cells, DDR memory support, PLL-based clocking, sysDSP slices, and SERDES blocks—provide the architectural building blocks needed for interface bridging, embedded control, and data buffering tasks in commercial designs.

This FPGA is well suited for designers seeking a mid-density, programmable solution that consolidates logic and memory on-chip while preserving a predictable power envelope and commercial operating range. The ECP5 family architecture and the device’s package options support practical deployment across a variety of surface-mount applications.

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