LFE5U-85F-8BG756I

IC FPGA 365 I/O 756CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA

Quantity 215 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package756-CABGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case756-FBGANumber of I/O365Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21000Number of Logic Elements/Cells84000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFE5U-85F-8BG756I – ECP5 Field Programmable Gate Array (FPGA)

The LFE5U-85F-8BG756I is an ECP5 family FPGA from Lattice Semiconductor Corporation. It implements the ECP5 architecture in a high-density FPGA IC targeted for industrial applications.

With 84,000 logic elements, approximately 3.83 Mbits of embedded memory and 365 user I/O pins in a 756‑FBGA (756‑CABGA, 27×27) package, this device is positioned for designs that require a balance of logic capacity, on-chip memory and flexible I/O options while operating across an industrial temperature range.

Key Features

  • Core Logic — Approximately 84,000 logic elements derived from the ECP5 family architecture, providing a substantial programmable fabric for control, glue logic and mid-density FPGA functions.
  • Embedded Memory — Approximately 3.83 Mbits of on-chip RAM. The ECP5 family memory architecture supports single, dual and pseudo‑dual port modes, initialization and cascading for flexible memory partitioning.
  • I/O and Interfaces — 365 user I/O pins in programmable I/O cells. The family-level documentation includes DDR memory support, on‑chip programmable termination and SERDES/PCS resources for high‑speed interfaces.
  • DSP and Clocking — Architecture-level sysDSP slices and a comprehensive clocking structure including PLLs, clock dividers and DDRDLL for phase and frequency control across logic and memory interfaces.
  • Package & Power — Surface-mount 756‑FBGA package (supplier device package: 756‑CABGA, 27×27). Core supply operating range specified at 1.045 V to 1.155 V for consistent low-voltage operation.
  • Temperature & Reliability — Industrial grade device with an operating temperature range of −40 °C to 100 °C. RoHS‑compliant and includes family-level features such as IEEE 1149.1 boundary scan and Single Event Upset (SEU) support described in the datasheet.
  • Configuration & System Features — ECP5 family configuration and device-level features include enhanced configuration options and on‑chip oscillator capabilities as documented in the datasheet.

Typical Applications

  • Industrial Control & Automation — Distributed controllers, motor control logic and protocol bridging that benefit from industrial temperature rating and a large I/O count.
  • Communications & Networking — PHY adaptation, protocol conversion and mid‑rate SERDES interfaces leveraging programmable I/O and on‑chip SERDES/PCS resources.
  • Video, Imaging & DSP Offload — Image preprocessing, data aggregation and pipeline tasks that use available embedded memory and sysDSP slices for deterministic datapath operations.
  • Memory Interface & Storage Logic — DDR memory controllers and buffering logic supported by the device’s DDR features and memory configuration options.

Unique Advantages

  • Strong logic-to-I/O density: 84,000 logic elements paired with 365 I/O pins enables complex designs with large peripheral connectivity without external glue logic.
  • Integrated memory resources: Approximately 3.83 Mbits of on‑chip RAM and flexible memory modes simplify data buffering and reduce external memory dependency for many designs.
  • Industrial-ready thermal range: Rated from −40 °C to 100 °C, making it suitable for equipment deployed in demanding environments.
  • Compact, high‑pin package: 756‑FBGA (27×27) package provides high I/O count in a compact surface‑mount form factor for space‑constrained boards.
  • Low-voltage core operation: Narrow core supply range (1.045 V–1.155 V) supports consistent power delivery and predictable thermal behavior across production units.
  • Family-level system features: ECP5 family architecture includes PLLs, clocking infrastructure, SERDES, DDR support and boundary‑scan testability, enabling system-level integration and verification.

Why Choose LFE5U-85F-8BG756I?

The LFE5U-85F-8BG756I brings a balanced combination of programmable logic, embedded memory and substantial I/O in an industrial-grade FPGA package. It is well suited for engineers and design teams building mid-density FPGA solutions that demand reliable operation across temperature extremes and flexible interface support.

As part of the ECP5 family from Lattice Semiconductor Corporation, this device leverages family-level architecture and documented features—such as programmable I/O cells, SERDES/PCS resources, DDR support and robust clocking—to provide a scalable option for a wide range of industrial and communications designs.

Request a quote or submit an RFQ to obtain pricing and availability for LFE5U-85F-8BG756I and plan your next design with its documented capabilities and industrial specifications.

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