LFE5UM-25F-6BG381I

IC FPGA 197 I/O 381CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192 24000 381-FBGA

Quantity 330 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package381-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case381-FBGANumber of I/O197Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells24000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of LFE5UM-25F-6BG381I – ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192 24000 381-FBGA

The LFE5UM-25F-6BG381I is an industrial-grade FPGA from the ECP5 family by Lattice Semiconductor Corporation. It delivers a balanced mix of programmable logic, on-chip memory, and high I/O density in a compact 381-FBGA surface-mount package.

This device is suited for industrial and embedded designs that require substantial logic capacity (24,000 logic elements), wide I/O connectivity (197 I/Os), and approximately 1.03 Mbits of embedded RAM while operating across a broad industrial temperature range.

Key Features

  • Logic Capacity — 24,000 logic elements providing programmable resources for custom digital logic and control functions; 6,000 logic blocks support design mapping and partitioning.
  • Embedded Memory — Approximately 1.03 Mbits of total on-chip RAM for frame buffers, FIFOs, and small data stores without external memory.
  • I/O Density — 197 available I/Os to support multiple interfaces, peripherals, and parallel buses directly from the FPGA.
  • Package and Mounting — 381-FBGA package (supplier device package: 381-CABGA, 17×17) in a surface-mount form factor for compact system integration.
  • Power Supply — Core supply operating in a defined range from 1.045 V to 1.155 V for stable core voltage specification.
  • Industrial Operating Range — Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
  • Compliance — RoHS-compliant manufacturing status.

Typical Applications

  • Industrial Control — Implement custom control logic, state machines, and interface bridging in factory automation and process-control equipment operating across industrial temperatures.
  • Embedded Systems — Provide programmable glue logic, peripheral aggregation, and protocol conversion in compact embedded devices that require on-chip memory and flexible I/O.
  • Communications and Networking — Support packet processing, I/O aggregation, or interface adaptation where many I/Os and embedded RAM are used to buffer or route data.

Unique Advantages

  • Balanced resource mix: Combines 24,000 logic elements with ~1.03 Mbits of RAM to handle control, buffering, and moderate DSP-like tasks without external memory.
  • High I/O count: 197 I/Os let you consolidate multiple peripherals and interfaces directly to the FPGA, reducing external glue logic.
  • Industrial robustness: Qualified for −40 °C to 100 °C operation to meet the environmental demands of industrial deployments.
  • Compact system footprint: 381-FBGA (381-CABGA, 17×17) surface-mount package enables dense board layouts while keeping interfaces close to the FPGA.
  • Defined core supply window: Narrow supply range (1.045 V–1.155 V) aids in predictable power delivery and design planning.
  • RoHS-compliant: Aligned with environmental directives for lead-free assembly and regulatory compliance.

Why Choose LFE5UM-25F-6BG381I?

As part of the ECP5 family from Lattice Semiconductor Corporation, the LFE5UM-25F-6BG381I offers a practical combination of logic density, embedded memory, and high I/O count in an industrial-grade FPGA. Its specifications make it suitable for designers who need a reliable, compact programmable device for industrial and embedded applications requiring consistent operation from −40 °C to 100 °C.

Choose this device when your design requires a balance of on-chip resources and I/O flexibility with a known core supply window and RoHS compliance; it is appropriate for teams focused on integration density, predictable power planning, and industrial environmental tolerance.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the LFE5UM-25F-6BG381I. Our team can provide further ordering and packaging details to support your BOM and project schedule.

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