LFE5UM-25F-7BG381I

IC FPGA 197 I/O 381CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192 24000 381-FBGA

Quantity 178 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package381-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case381-FBGANumber of I/O197Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells24000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of LFE5UM-25F-7BG381I – ECP5 Field Programmable Gate Array (FPGA) IC 197 I/O, ~1.03 Mbits RAM, 24,000 Logic Elements, 381-FBGA

The LFE5UM-25F-7BG381I is an industrial-grade ECP5 FPGA in a 381-FBGA package offering a balance of programmable logic, embedded memory and I/O density for embedded and communications designs. It integrates 24,000 logic elements and approximately 1.03 Mbits of on-chip RAM, delivering the building blocks needed for custom logic, protocol bridging and signal processing tasks.

Designed for surface-mount assembly, the device supports robust operating conditions with a supply range of 1.045 V to 1.155 V and an industrial temperature range from -40 °C to 100 °C, making it suitable for demanding system-level deployments.

Key Features

  • Programmable Logic Capacity  24,000 logic elements for implementing custom digital logic, control paths and finite-state machines.
  • Embedded Memory  Approximately 1.03 Mbits of total on-chip RAM to support frame buffers, FIFOs, parameter storage and local data caching.
  • High-Density I/O  197 user I/O pins in a 381-FBGA package (supplier device package: 381-CABGA, 17×17) for external interfaces and board-level connectivity.
  • Clocking and Timing  Integrated clocking and PLL architecture from the ECP5 family (including sysCLOCK PLL and clock distribution features) to support synchronous designs and complex timing domains.
  • Memory and DSP Support  sysMEM and sysDSP architecture elements in the ECP5 family provide memory block functionality and DSP-friendly slices for arithmetic and signal processing functions.
  • SERDES and Serial Protocols  Flexible SERDES and PCS building blocks in the family enable implementation of high-speed serial interfaces and physical coding sublayers.
  • Programmable I/O Cells  Rich programmable I/O cell architecture with support for multiple I/O behaviors and standards as documented for the ECP5 family.
  • Configuration and Reliability  Enhanced configuration options, on-chip oscillator and SEU support capabilities described in the ECP5 family data sheet, plus IEEE 1149.1-compliant boundary scan testability for manufacturing and debug.
  • Mounting and Environmental  Surface-mount package with RoHS compliance and industrial operating temperature suitable for extended-temperature applications.

Typical Applications

  • High‑speed Serial Interfaces: Use the device's SERDES and PCS resources to implement protocol bridges, link aggregation and custom serial PHY logic.
  • Communications and Networking: Implement packet processing, timing adaptation and interface conversion leveraging embedded memory and programmable logic.
  • Industrial Control and Automation: Deploy in control systems and instrumentation where industrial temperature range, configurable I/O and robust power rails are required.
  • Embedded System Glue Logic: Replace multi‑chip glue solutions with integrated programmable logic and on-chip RAM to simplify board design and reduce BOM.

Unique Advantages

  • Balanced Logic and Memory: 24,000 logic elements paired with ~1.03 Mbits of embedded RAM provide a practical mix for mid-density logic and buffering needs.
  • Dense I/O in Compact Package: 197 I/O pins in a 381-FBGA (17×17) package enable high connectivity without a large PCB footprint.
  • Industrial Robustness: Specified for -40 °C to 100 °C operation and RoHS compliant, supporting deployments in extended-temperature environments.
  • Tightly Controlled Power Supply Range: Narrow VCC range (1.045 V to 1.155 V) supports predictable power budgeting and voltage sequencing in system design.
  • Family-Level Architecture: ECP5 family features — including programmable I/O, clocking, SERDES and memory/DSP blocks — let designers leverage established architecture elements documented in the ECP5 data sheet.

Why Choose LFE5UM-25F-7BG381I?

This ECP5 FPGA device provides a pragmatic combination of logic density, embedded memory and I/O capacity in a compact 381-FBGA package for industrial applications. Its documented family-level features — clocking, programmable I/O, SERDES, memory and DSP slices — make it well suited for mid-density embedded designs that require configurable hardware acceleration, interface bridging or protocol handling while meeting extended temperature requirements.

Designers and procurement teams will find the LFE5UM-25F-7BG381I applicable for projects needing stable supply requirements, extensive I/O and the flexibility of FPGA-based customization with the ecosystem and documentation available for the ECP5 family.

Request a quote or submit your requirements to receive pricing and lead-time information for the LFE5UM-25F-7BG381I. Our team will respond with a tailored quote and availability for your project needs.

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