LFE5UM-25F-7BG381I
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192 24000 381-FBGA |
|---|---|
| Quantity | 178 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 197 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 24000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1032192 |
Overview of LFE5UM-25F-7BG381I – ECP5 Field Programmable Gate Array (FPGA) IC 197 I/O, ~1.03 Mbits RAM, 24,000 Logic Elements, 381-FBGA
The LFE5UM-25F-7BG381I is an industrial-grade ECP5 FPGA in a 381-FBGA package offering a balance of programmable logic, embedded memory and I/O density for embedded and communications designs. It integrates 24,000 logic elements and approximately 1.03 Mbits of on-chip RAM, delivering the building blocks needed for custom logic, protocol bridging and signal processing tasks.
Designed for surface-mount assembly, the device supports robust operating conditions with a supply range of 1.045 V to 1.155 V and an industrial temperature range from -40 °C to 100 °C, making it suitable for demanding system-level deployments.
Key Features
- Programmable Logic Capacity 24,000 logic elements for implementing custom digital logic, control paths and finite-state machines.
- Embedded Memory Approximately 1.03 Mbits of total on-chip RAM to support frame buffers, FIFOs, parameter storage and local data caching.
- High-Density I/O 197 user I/O pins in a 381-FBGA package (supplier device package: 381-CABGA, 17×17) for external interfaces and board-level connectivity.
- Clocking and Timing Integrated clocking and PLL architecture from the ECP5 family (including sysCLOCK PLL and clock distribution features) to support synchronous designs and complex timing domains.
- Memory and DSP Support sysMEM and sysDSP architecture elements in the ECP5 family provide memory block functionality and DSP-friendly slices for arithmetic and signal processing functions.
- SERDES and Serial Protocols Flexible SERDES and PCS building blocks in the family enable implementation of high-speed serial interfaces and physical coding sublayers.
- Programmable I/O Cells Rich programmable I/O cell architecture with support for multiple I/O behaviors and standards as documented for the ECP5 family.
- Configuration and Reliability Enhanced configuration options, on-chip oscillator and SEU support capabilities described in the ECP5 family data sheet, plus IEEE 1149.1-compliant boundary scan testability for manufacturing and debug.
- Mounting and Environmental Surface-mount package with RoHS compliance and industrial operating temperature suitable for extended-temperature applications.
Typical Applications
- High‑speed Serial Interfaces: Use the device's SERDES and PCS resources to implement protocol bridges, link aggregation and custom serial PHY logic.
- Communications and Networking: Implement packet processing, timing adaptation and interface conversion leveraging embedded memory and programmable logic.
- Industrial Control and Automation: Deploy in control systems and instrumentation where industrial temperature range, configurable I/O and robust power rails are required.
- Embedded System Glue Logic: Replace multi‑chip glue solutions with integrated programmable logic and on-chip RAM to simplify board design and reduce BOM.
Unique Advantages
- Balanced Logic and Memory: 24,000 logic elements paired with ~1.03 Mbits of embedded RAM provide a practical mix for mid-density logic and buffering needs.
- Dense I/O in Compact Package: 197 I/O pins in a 381-FBGA (17×17) package enable high connectivity without a large PCB footprint.
- Industrial Robustness: Specified for -40 °C to 100 °C operation and RoHS compliant, supporting deployments in extended-temperature environments.
- Tightly Controlled Power Supply Range: Narrow VCC range (1.045 V to 1.155 V) supports predictable power budgeting and voltage sequencing in system design.
- Family-Level Architecture: ECP5 family features — including programmable I/O, clocking, SERDES and memory/DSP blocks — let designers leverage established architecture elements documented in the ECP5 data sheet.
Why Choose LFE5UM-25F-7BG381I?
This ECP5 FPGA device provides a pragmatic combination of logic density, embedded memory and I/O capacity in a compact 381-FBGA package for industrial applications. Its documented family-level features — clocking, programmable I/O, SERDES, memory and DSP slices — make it well suited for mid-density embedded designs that require configurable hardware acceleration, interface bridging or protocol handling while meeting extended temperature requirements.
Designers and procurement teams will find the LFE5UM-25F-7BG381I applicable for projects needing stable supply requirements, extensive I/O and the flexibility of FPGA-based customization with the ecosystem and documentation available for the ECP5 family.
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