LFE5UM-25F-8BG381I
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192 24000 381-FBGA |
|---|---|
| Quantity | 758 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 197 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 24000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1032192 |
Overview of LFE5UM-25F-8BG381I – ECP5 FPGA, 24,000 logic elements, 381‑FBGA
The LFE5UM-25F-8BG381I is an industrial-grade FPGA from Lattice Semiconductor's ECP5 family. It provides a mid-density FPGA fabric with 24,000 logic elements and approximately 1.03 Mbits of embedded RAM, packaged in a high-density 381‑FBGA (supplier package: 381‑CABGA, 17×17) surface-mount package.
With 197 user I/Os, a narrow core supply range (1.045 V to 1.155 V) and an extended operating temperature range (−40 °C to 100 °C), this device targets industrial and communications-focused designs that require a balance of integration, I/O density and on-chip memory.
Key Features
- Core Logic 24,000 logic elements provide mid-range programmable logic capacity suitable for complex glue logic, protocol bridging and moderate-compute tasks.
- Embedded Memory Approximately 1.03 Mbits of on-chip RAM for data buffering, packet staging, and local storage inside the FPGA fabric.
- I/O and Packaging 197 user I/Os in a 381‑FBGA package (supplier: 381‑CABGA, 17×17) enables high-density interfacing in a compact surface-mount form factor.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
- Low-Voltage Core Supply Core supply specification of 1.045 V to 1.155 V supports low-voltage system designs and predictable power budgeting.
- Family-Level Architecture As part of the ECP5 family (per the ECP5 family datasheet), the device benefits from documented architecture features such as programmable I/O cells, clocking structures including PLLs, DDR memory support, SERDES/PCS blocks and on-chip configuration options.
- Surface Mount Surface-mount package suitable for automated PCB assembly processes.
- RoHS Compliant Manufactured to meet RoHS environmental compliance requirements.
Typical Applications
- Industrial Automation Mid-density programmable logic for control, sensor interfacing and protocol conversion in industrial equipment operating across a wide temperature range.
- Communications Equipment I/O density and ECP5 family SERDES/PCS and DDR support (per family datasheet) make the device suitable for networking and connectivity modules.
- Embedded Systems & Prototyping Provides on-chip memory and logic capacity for embedded system prototypes, custom accelerators and interface bridging.
- High‑Density I/O Systems Large number of user I/Os supports board-level aggregation, multi-protocol front-ends and complex peripheral interfaces.
Unique Advantages
- Balanced Logic and Memory: 24,000 logic elements paired with approximately 1.03 Mbits of embedded RAM delivers a balanced platform for both control logic and data buffering.
- High I/O Count in Compact Package: 197 I/Os in a 381‑FBGA (381‑CABGA 17×17) package reduces board-level routing complexity while keeping a small PCB footprint.
- Engineered for Industrial Use: Rated for −40 °C to 100 °C operation, supporting deployments in demanding environmental conditions.
- Low-Voltage Core Operation: Narrow core voltage range (1.045 V–1.155 V) simplifies power supply design and aids predictable power budgeting.
- Family-Level Capabilities: Leverages ECP5 family architecture elements—programmable I/O cells, clocking/PLL structures, DDR support and SERDES/PCS blocks—documented in the ECP5 family datasheet.
- Regulatory and Assembly Ready: RoHS-compliant surface-mount package suitable for modern automated assembly processes.
Why Choose LFE5UM-25F-8BG381I?
The LFE5UM-25F-8BG381I is positioned as a mid-density, industrial-grade FPGA that combines substantial logic capacity with on-chip memory and high I/O density in a compact FBGA package. It is well suited for engineers designing industrial control, communications interfaces and embedded systems that require stable operation across extended temperature ranges and dense connectivity.
As part of the ECP5 family, this device aligns with a clearly documented architecture—covering programmable I/O, clocking, SERDES and DDR support—providing a consistent foundation for scalable designs that need both logic and memory resources in a single, surface-mount component.
Request a quote or submit an order inquiry to get pricing and availability for LFE5UM-25F-8BG381I. Our team can provide lead-time and supply details to support your design and procurement process.