LFE5UM-25F-8MG285I
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 118 1032192 24000 285-LFBGA, CSPBGA |
|---|---|
| Quantity | 920 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 285-CSFBGA (10x10) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 285-LFBGA, CSPBGA | Number of I/O | 118 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 24000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1032192 |
Overview of LFE5UM-25F-8MG285I – ECP5 Field Programmable Gate Array (FPGA) IC 118 1032192 24000 285-LFBGA, CSPBGA
The LFE5UM-25F-8MG285I is an FPGA device from the Lattice ECP5 family offering a balanced mix of programmable logic resources, embedded memory, DSP capability and high-speed serial support. It targets designs that require flexible I/O, deterministic operation across extended temperatures, and compact board-level integration.
Built with approximately 24,000 logic elements and about 1.03 Mbits of embedded memory, the device provides a programmable fabric with 118 I/O pins and industry-grade operating conditions (–40 °C to 100 °C), packaged in a 285-ball LFBGA (10×10) surface-mount package.
Key Features
- Logic Fabric Approximately 24,000 logic elements and 6,000 logic blocks provide a sizable programmable fabric for glue logic, state machines and custom accelerators.
- Embedded Memory Total on-chip RAM of 1,032,192 bits (approximately 1.03 Mbits) for buffering, FIFOs and local data storage.
- DSP and Signal Processing Family-level sysDSP features documented in the ECP5 data sheet enable embedded arithmetic and signal-processing implementations.
- SERDES and High-Speed Serial Support ECP5 family documentation includes SERDES and PCS blocks for high-speed serial connectivity and protocol implementations.
- Programmable I/O and DDR Support Comprehensive programmable I/O cells, DDR memory support and on-chip I/O features described in the datasheet enable flexible interfacing with peripherals and external memory.
- Clocking and PLL Integrated clocking structures, including sysCLOCK PLL and clock distribution resources, support complex clocking schemes within designs.
- Power and Voltage Core supply requirements documented as 1.045 V to 1.155 V for defined operating conditions.
- Industrial Temperature Grade Rated for operation from –40 °C to 100 °C to meet industrial environment requirements.
- Package and Mounting 285-LFBGA (supplier package 285-CSFBGA, 10×10) surface-mount package for compact board-level integration.
- Regulatory Compliance RoHS-compliant status for environmental compliance in manufacturing and supply chains.
Typical Applications
- High‑speed serial interfaces Implement protocol bridging and serial link PHYs using the ECP5 family SERDES and PCS capabilities.
- Memory controller and buffering Use on-chip RAM and DDR support for local buffering, FIFOs and interface timing alignment with external memories.
- Embedded signal processing Leverage documented sysDSP resources and the logic fabric for fixed-point/streaming processing tasks.
- Industrial control and I/O aggregation Industrial temperature rating and flexible programmable I/O make the device suitable for control, I/O expansion and protocol conversion in industrial systems.
Unique Advantages
- Balanced integration of logic and memory A combination of approximately 24,000 logic elements and ~1.03 Mbits of embedded RAM reduces dependence on external components for common buffering and control tasks.
- On‑chip DSP and SERDES capability Documented sysDSP slices and SERDES/PCS blocks allow designers to implement signal processing and high-speed serial connectivity within a single device.
- Deterministic industrial operation Grade and temperature range (–40 °C to 100 °C) support deployment in industrial environments with defined thermal margins.
- Compact, surface-mount packaging The 285-LFBGA (10×10) package enables a small PCB footprint while providing up to 118 I/Os for system integration.
- Tight core voltage specification Defined supply range (1.045 V to 1.155 V) supports controlled power delivery and predictable device behavior within validated operating conditions.
- RoHS compliance Environmentally compliant manufacturing and supply-chain compatibility.
Why Choose LFE5UM-25F-8MG285I?
The LFE5UM-25F-8MG285I delivers a practical balance of programmable logic density, embedded memory and family-level peripherals documented in the ECP5 data sheet—making it well suited for industrial applications that require flexible I/O, on-chip processing and high-speed serial links. Its defined core voltage range, industrial temperature rating and compact 285-LFBGA package simplify system-level engineering and board integration.
This part is appropriate for engineers and procurement teams building control, interface and communication subsystems that need scalable programmable resources and documented family features such as DSP slices, SERDES, clocking and DDR support.
Request a quote or submit your procurement inquiry to receive pricing and availability for LFE5UM-25F-8MG285I. Our team will respond with the information you need to move your design forward.