LFE5UM-45F-6BG554C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 245 1990656 44000 554-FBGA |
|---|---|
| Quantity | 903 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 554-CABGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 554-FBGA | Number of I/O | 245 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11000 | Number of Logic Elements/Cells | 44000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1990656 |
Overview of LFE5UM-45F-6BG554C – ECP5 Field Programmable Gate Array (FPGA) IC 245 1990656 44000 554-FBGA
The LFE5UM-45F-6BG554C is an ECP5 family FPGA from Lattice Semiconductor provided in a 554-FBGA (23×23) package. It integrates programmable logic, on-chip memory, and a broad set of I/O resources suitable for mid-density FPGA tasks.
This device is targeted at applications that require a balance of logic capacity, embedded memory, and flexible I/O in a compact surface-mount package. Key attributes include approximately 44,000 logic elements, roughly 1.99 Mbits of embedded RAM, and 245 user I/Os, with a commercial operating temperature range and RoHS compliance.
Key Features
- Programmable logic — Approximately 44,000 logic elements with an architecture derived from the Lattice ECP5 family (datasheet describes slices, PFU blocks and routing).
- Logic block count — 11,000 CLBs (as listed in product data) supporting combinatorial and registered functions across the device.
- Embedded memory — Total on-chip RAM of 1,990,656 bits (approximately 1.99 Mbits) for buffering, FIFOs, and local storage.
- I/O capacity — 245 programmable I/O pins in a 554-FBGA package for broad interface flexibility.
- High-speed interfaces and DSP — Family-level architecture includes SERDES, sysDSP slice, and programmable I/O cells as described in the ECP5 datasheet.
- Clocking and timing — Integrated clocking architecture with PLLs and distributed clock networks documented in the ECP5 family data sheet.
- Power and supply — Core voltage supply range of 1.045 V to 1.155 V to match supported operating conditions.
- Package and mounting — 554-CABGA (23×23) package in 554-FBGA format, surface-mount mounting type for board-level integration.
- Temperature and grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental — RoHS compliant.
Typical Applications
- High-speed interface bridging — Use SERDES and programmable I/O to implement protocol conversion and link aggregation in communications and networking modules.
- Memory controller and buffering — On-chip RAM and DDR support in the ECP5 family enable memory interface logic and data buffering tasks.
- Embedded control and I/O aggregation — Mid-density logic and abundant I/O make the device suitable for consolidating control, sensor interfaces, and peripheral management.
Unique Advantages
- Balanced logic and memory — Combines approximately 44,000 logic elements with about 1.99 Mbits of embedded RAM to support both control logic and local data storage.
- Generous I/O count — 245 I/Os in a compact 554-FBGA package provide broad interface options without a large board footprint.
- Compact surface-mount package — 554-CABGA (23×23) packaging enables integration into space-constrained assemblies.
- Family-level feature set — ECP5 family architecture described in the datasheet includes programmable I/O cells, sysDSP slices, SERDES blocks and PLL-based clocking for flexible system integration.
- Controlled supply range — Core supply specification (1.045 V to 1.155 V) supports predictable power design and sequencing per device recommendations.
- Regulatory compliance — RoHS compliance simplifies environmental and sourcing requirements.
Why Choose LFE5UM-45F-6BG554C?
The LFE5UM-45F-6BG554C is positioned for designs that need mid-density programmable logic, substantial on-chip RAM, and a high I/O count in a compact, surface-mount package. As a member of the Lattice ECP5 family, it leverages the series’ documented architecture—programmable I/O, DSP-oriented slices, SERDES capability, and flexible clocking—to address interface, control, and buffering requirements within commercial-temperature systems.
This device is suited to engineers and procurement teams seeking a commercially graded FPGA with verifiable on-chip resources (logic elements, RAM, and I/O) and a clearly defined supply and temperature envelope for predictable integration into embedded and communications-oriented designs.
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