LFE5UM-45F-6BG381C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 203 1990656 44000 381-FBGA |
|---|---|
| Quantity | 1,854 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 203 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11000 | Number of Logic Elements/Cells | 44000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1990656 |
Overview of LFE5UM-45F-6BG381C – ECP5 FPGA, 44,000 Logic Elements, 203 I/Os, 381-FBGA
The LFE5UM-45F-6BG381C is a field programmable gate array (FPGA) from the Lattice ECP5 family offering 44,000 logic elements and approximately 1.99 Mbits of on-chip RAM. It is a commercial-grade, surface-mount device in a 381-FBGA (381-CABGA, 17×17) package that targets designs requiring reconfigurable digital logic, flexible I/O and on-chip memory.
Architecturally, the ECP5 family datasheet highlights features such as programmable I/O cells, DDR memory support, SERDES, sysDSP slices, PLL-based clocking and device configuration options, providing a platform suitable for consolidating digital functions and implementing custom interfaces within a compact footprint.
Key Features
- Logic Density 44,000 logic elements for implementing moderate-density FPGA designs and custom digital logic.
- Embedded Memory Approximately 1.99 Mbits of total on-chip RAM to support buffering, frame storage and local data processing.
- I/O Capacity 203 user I/Os to accommodate multiple parallel interfaces and mixed-signal connections at the board level.
- On-chip Architecture (ECP5 family) Includes programmable I/O cells, clocking (PLLs and clock distribution), sysDSP slices, DDR memory support and SERDES capability as described in the ECP5 family datasheet.
- Power Nominal core voltage range of 1.045 V to 1.155 V for core power planning and supply design.
- Package & Mounting 381-FBGA package (supplier device package: 381-CABGA, 17×17) with surface-mount mounting type for compact board integration.
- Temperature & Grade Commercial grade operation from 0 °C to 85 °C for typical commercial and industrial-adjacent applications.
- Environmental Compliance RoHS compliant for lead-free production and regulatory alignment.
Typical Applications
- Reconfigurable Logic Implement custom digital functions and state machines where in-field programmability is required.
- Interface Bridging Consolidate multiple parallel and serial interfaces using the device’s 203 I/Os and the family’s SERDES and programmable I/O features.
- On-board Data Processing Use embedded memory and sysDSP slices for local buffering, preprocessing and algorithm acceleration within a compact FPGA footprint.
Unique Advantages
- High Logic Capacity: 44,000 logic elements enable substantial logic implementation without moving to larger, more expensive families.
- Generous I/O Count: 203 I/Os support complex multi-interface boards and flexible pinout assignments.
- On-chip Memory Resource: Approximately 1.99 Mbits of embedded RAM reduces external memory dependency for many control and buffering tasks.
- Compact Packaging: 381-FBGA (17×17) package offers a dense, board-friendly solution for space-constrained designs.
- Commercial Grade Suitability: Rated for 0 °C to 85 °C operation, aligning with many commercial product and prototype requirements.
- Regulatory Alignment: RoHS compliance supports lead-free manufacturing workflows.
Why Choose LFE5UM-45F-6BG381C?
The LFE5UM-45F-6BG381C delivers a balanced combination of logic density, embedded memory and I/O resources in a compact 381-FBGA package, drawing on the ECP5 family architecture features documented in the datasheet. It is suited to engineers who need a reprogrammable platform capable of consolidating interfaces, performing on-chip data processing and implementing custom logic without migrating to larger FPGA families.
Backed by the ECP5 family’s architecture—programmable I/O, DDR support, SERDES, sysDSP and robust clocking options—this device provides a scalable building block for production designs and prototypes where commercial-grade temperature range, RoHS compliance and controlled core voltage are required.
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