LFE5UM-25F-7MG285I
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 118 1032192 24000 285-LFBGA, CSPBGA |
|---|---|
| Quantity | 459 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 285-CSFBGA (10x10) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 285-LFBGA, CSPBGA | Number of I/O | 118 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 24000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1032192 |
Overview of LFE5UM-25F-7MG285I – ECP5 FPGA, 24,000 logic elements, 285-LFBGA
The LFE5UM-25F-7MG285I is an ECP5 Field Programmable Gate Array (FPGA) IC featuring 24,000 logic elements and approximately 1.03 Mbits of embedded memory (1,032,192 bits). It offers up to 118 I/Os in a 285-LFBGA (285-CSFBGA, 10×10) surface-mount package and is specified for industrial-grade operation.
Family-level documentation for the ECP5 series describes a flexible architecture with programmable I/O, sysDSP slices, SERDES, configurable clocking (including PLLs) and DDR memory support, enabling compact, reprogrammable implementations that combine logic, memory and flexible I/O in a single device.
Key Features
- Core Logic 24,000 logic elements provide the reconfigurable fabric for implementing custom digital logic, control and protocol functions.
- Embedded Memory Approximately 1.03 Mbits of on-chip RAM (1,032,192 bits) for local buffering, tables and state storage.
- I/O and Programmable I/O Up to 118 I/Os in a compact BGA package with family-level sysI/O buffer functionality referenced in the ECP5 documentation.
- Clocking and Timing Family datasheet details configurable clocking resources including PLLs and a distributed clock network for synchronous designs.
- DSP and High-Speed Interfaces The ECP5 family includes sysDSP slice architecture and SERDES/PCS blocks as documented in the datasheet for signal processing and high-speed serial lanes.
- Power and Voltage Supported core supply range: 1.045 V to 1.155 V, enabling designs that adhere to the device’s recommended operating conditions.
- Package and Mounting 285-LFBGA (285-CSFBGA, 10×10) surface-mount package for dense board integration.
- Temperature and Grade Industrial grade with an operating temperature range of -40 °C to 100 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Custom digital logic and prototyping — Use the 24,000 logic elements and on-chip memory to implement and iterate custom state machines, protocol handlers and control logic.
- Memory-interfacing systems — Approximately 1.03 Mbits of embedded RAM plus family-level DDR support make the device suitable for buffering and packet staging tasks.
- I/O-dense peripheral control — Up to 118 I/Os and programmable I/O buffers enable aggregation and management of multiple peripherals, sensors and buses on a single device.
- Signal processing and timing-critical functions — sysDSP slices and configurable clocking/PLLs documented in the family datasheet support arithmetic and deterministic timing requirements.
Unique Advantages
- Scalable logic density: 24,000 logic elements provide a balance of programmable resources for medium-complexity designs without excessive board-level partitioning.
- Significant on-chip memory: Approximately 1.03 Mbits of embedded RAM reduces reliance on external memory for many buffering and lookup needs.
- Flexible I/O count: 118 I/Os in a compact 285-LFBGA package simplify board-level routing for multi-peripheral systems.
- Industrial-grade robustness: Rated for -40 °C to 100 °C operation to meet demanding environmental requirements.
- Compact surface-mount package: 285-CSFBGA (10×10) enables high-density PCB integration while keeping a small footprint.
- Family-level feature set: ECP5 family documentation includes programmable I/O, sysDSP, SERDES, PLLs and DDR support for a wide range of design requirements.
Why Choose LFE5UM-25F-7MG285I?
The LFE5UM-25F-7MG285I positions itself as a versatile mid-density FPGA option within the ECP5 family, offering a combination of 24,000 logic elements, approximately 1.03 Mbits of embedded memory and up to 118 I/Os in a compact industrial-grade BGA package. These attributes make the device suitable for designs that require on-chip memory, flexible I/O routing and reprogrammable logic while operating across a wide temperature range.
Designers looking for a single-chip solution to consolidate control logic, buffering and I/O interfacing will find the documented ECP5 family features—such as programmable I/O, DSP slices, SERDES and configurable clocking—relevant to system-level integration and long-term scalability.
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