LFE5UM-25F-7BG381C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192 24000 381-FBGA |
|---|---|
| Quantity | 879 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 197 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 24000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1032192 |
Overview of LFE5UM-25F-7BG381C – ECP5 FPGA, 24,000 logic elements, 197 I/Os, 381-FBGA
The LFE5UM-25F-7BG381C is a commercial-grade Field Programmable Gate Array (FPGA) from the ECP5 family by Lattice Semiconductor Corporation. It implements the ECP5 architecture in a compact 381-FBGA (381-CABGA, 17×17) surface-mount package and is intended for commercial embedded designs.
With 24,000 logic elements, approximately 1.03 Mbits of embedded memory, and up to 197 I/Os, this device targets designs that require moderate logic density, substantial on-chip RAM, and flexible I/O capability while operating from a low-voltage core supply (1.045 V to 1.155 V) over a commercial temperature range (0 °C to 85 °C).
Key Features
- Core Logic 24,000 logic elements provide the programmable fabric for custom logic, state machines, and glue logic implementations.
- Embedded Memory Approximately 1.03 Mbits of on-chip RAM for data buffering, FIFOs, and local storage without external memory.
- I/O Capacity Up to 197 user I/Os support broad interfacing options for parallel buses, control signals, and peripheral connections.
- Package & Mounting 381-FBGA (381-CABGA, 17×17) surface-mount package minimizes board footprint while delivering high pin count.
- Power Low-voltage core supply range of 1.045 V to 1.155 V to match system power-rail constraints.
- Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Design Architecture (ECP5 Family) Family-level architecture and features include programmable I/O cells, clocking structures with PLLs, sysMEM memory blocks, sysDSP slices, DDR memory support, SERDES/PCS blocks, and on-chip configuration options as described in the ECP5 family datasheet.
- Regulatory RoHS compliant.
Typical Applications
- Commercial Embedded Systems Use the FPGA to implement custom logic, system control, and peripheral interfacing in commercial equipment where a commercial-grade device and compact package are required.
- I/O-Intensive Glue Logic Bridge and translate between multiple parallel or serialized interfaces using the device’s high I/O count and programmable fabric.
- On-Chip Memory and Buffering Leverage approximately 1.03 Mbits of embedded RAM for data buffering, packet buffering, and local storage without immediate dependence on external memory.
- High‑Speed Link and Memory Support Implement DDR memory interfaces and high-speed serial links using family-level DDR and SERDES capabilities documented for the ECP5 series.
Unique Advantages
- High Logic Density: 24,000 logic elements deliver the capacity to consolidate multiple functions into a single FPGA, reducing board-level component count.
- Substantial On-Chip RAM: Approximately 1.03 Mbits of embedded memory enables local data storage and buffering, simplifying memory architecture for many designs.
- Extensive I/O: Up to 197 I/Os provide flexible connectivity for interfacing to peripherals, sensors, buses, and external devices.
- Compact, High-Pin Package: The 381-FBGA (17×17) surface-mount package offers a high pin density in a small footprint suitable for space-constrained boards.
- Low-Voltage Operation: Narrow core supply range (1.045 V–1.155 V) aligns with modern power system designs and allows predictable power planning.
- Commercial-Rated Reliability: Rated for 0 °C to 85 °C operation, matching the needs of commercial product environments.
Why Choose LFE5UM-25F-7BG381C?
The LFE5UM-25F-7BG381C provides a balanced combination of programmable logic capacity, embedded memory, and high I/O count in a compact 381-FBGA package for commercial embedded projects. Its inclusion in the ECP5 family brings architectural features—such as programmable I/O cells, clocking structures, memory and DSP resources, DDR support, and SERDES blocks—that make it a versatile choice for designers consolidating multiple functions into a single FPGA.
This part is well suited to engineers and procurement teams seeking a commercial-grade FPGA with clearly specified operating voltages, temperature range, and package details. Using the documented ECP5 family capabilities together with the part’s supplied numeric specifications enables predictable integration into medium-complexity FPGA designs.
If you would like pricing or availability, request a quote or submit a procurement inquiry referencing part number LFE5UM-25F-7BG381C.