LFE5U-85F-8BG756C

The LFE5U-85F-8BG756C is a field-programmable gate array (FPGA) from Lattice Semiconductor's ECP5 family. It provides a high-density programmable fabric alongside embedded memory, abundant I/O and support for advanced on-chip functions described in the ECP5 family data sheet.

Designed for commercial-temperature applications, this device targets designs that require substantial logic capacity, significant on-chip RAM, and a large number of external interfaces, all packaged in a 756-ball FBGA footprint.

Key Features

• Programmable Logic Capacity — 84,000 logic elements to implement complex digital logic and custom processing pipelines.
• Embedded Memory — Approximately 3.8 Mbits of on-chip RAM for buffers, FIFOs and small data stores directly inside the FPGA fabric.
• High I/O Count — 365 user I/Os to support dense peripheral and bus connectivity without immediate need for expansion logic.
• Package and Mounting — 756‑FBGA (supplier device package: 756‑CABGA, 27×27 mm) in a surface-mount package for compact PCB integration.
• Power Supply — Core voltage range specified at 1.045 V to 1.155 V for system power planning and regulator selection.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial deployments.
• Standards and Compliance — RoHS compliant for environmental and manufacturing footprint considerations.
• ECP5 Family Architecture (per datasheet) — Includes documented subsystems such as programmable I/O cells, on-chip DSP and memory blocks, clocking resources and SERDES/PHY features described in the ECP5 family data sheet.

Typical Applications

• Interface Bridging and Protocol Conversion — Use the device's large I/O count and programmable fabric to implement custom interface logic and protocol translators.
• Embedded Signal Processing — Leverage on-chip logic and the ECP5 family’s documented DSP slices for real-time data filtering and processing tasks.
• Memory Controllers and Buffers — On-chip RAM (≈3.8 Mbits) supports buffering, FIFOs and small embedded memory needs for data-path designs.
• High-Density I/O Systems — 365 I/Os enable connection to dense sensor arrays, multi-channel I/O expansions or complex control panels.

Unique Advantages

• High Logic Density: 84,000 logic elements allow implementation of sizable, integrated digital systems within a single device.
• Significant On-Chip Memory: Approximately 3.8 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive Connectivity: 365 I/O pins support broad peripheral integration and flexible board-level partitioning.
• Compact, Standard Package: 756‑FBGA (27×27 mm) provides a space-efficient footprint for high-density boards while supporting surface-mount assembly.
• Commercial Ready: Specified for 0 °C to 85 °C operation and RoHS compliant for mainstream electronics applications.
• Well-documented Family Architecture: The ECP5 family data sheet details programmable I/O, clocking, memory and SERDES features to aid design planning and verification.

Why Choose LFE5U-85F-8BG756C?

The LFE5U-85F-8BG756C combines large logic capacity, meaningful on-chip memory and a high I/O count in a compact 756‑FBGA package, making it well suited for commercial designs that require integrated digital logic, interface density and embedded memory. Its specified core voltage range and commercial temperature rating simplify power and thermal planning for board-level designs.

Engineers building complex I/O-centric systems, protocol bridges, or embedded signal-processing functions will find the device’s mix of resources and the ECP5 family documentation useful for development, verification and deployment in standard commercial electronics.

Request a quote or submit an inquiry to begin procurement or to obtain pricing and lead-time information for the LFE5U-85F-8BG756C FPGA.