LFE5UM-85F-8MG285I

IC FPGA 118 I/O 285CSFBGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 118 3833856 84000 285-LFBGA, CSPBGA

Quantity 1,331 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package285-CSFBGA (10x10)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case285-LFBGA, CSPBGANumber of I/O118Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21000Number of Logic Elements/Cells84000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFE5UM-85F-8MG285I – ECP5 FPGA, approximately 84,000 logic elements, 118 I/Os, 285-LFBGA

The LFE5UM-85F-8MG285I is an ECP5 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, supplied in a 285-LFBGA (285-CSFBGA, 10×10) surface-mount package. The device integrates approximately 84,000 logic elements and roughly 3.8 Mbits of embedded RAM, along with programmable I/O and advanced on-chip resources described in the ECP5 family data sheet.

Designed for industrial-grade applications, this FPGA offers a combination of logic capacity, embedded memory, and on-chip features such as clocking, SERDES and programmable I/O that support a broad set of embedded digital designs requiring flexible, reprogrammable logic and system integration.

Key Features

  • Core Logic  Approximately 84,000 logic elements provide the programmable fabric for custom digital functions and glue logic.
  • Embedded Memory  Approximately 3.8 Mbits of on-chip RAM (3,833,856 bits) for data buffering, FIFOs, and embedded storage.
  • I/O Resources  118 user I/Os delivered via programmable I/O cells; device-level support for a variety of I/O behaviors is described in the ECP5 family documentation.
  • Clocking and PLLs  Integrated clocking architecture with sysCLOCK PLLs and a flexible clock distribution network to support multiple clock domains and timing strategies.
  • SERDES and High‑Speed Interfaces  Family-level SERDES and Physical Coding Sublayer (PCS) blocks are included in the ECP5 architecture for serial connectivity and interface implementation.
  • DSP and Memory Blocks  sysDSP slices and sysMEM memory blocks (documented in the ECP5 family data sheet) enable on-chip DSP functions and varied memory configurations including single, dual and pseudo-dual port modes.
  • Device Configuration and On‑Chip Utilities  ECP5 family configuration features include device configuration options, on-chip oscillator and support blocks referenced in the family data sheet.
  • Package and Mounting  285-LFBGA (CSPBGA) 10×10 supplier device package; surface-mount mounting type suited for compact board designs.
  • Industrial Temperature Grade  Rated for operation from -40°C to 100°C to meet industrial environmental requirements.
  • Core Power  Specified core supply range of 1.045 V to 1.155 V for device operation.
  • RoHS Compliance  RoHS compliant per supplier declaration.

Typical Applications

  • High‑speed serial interfaces  Use the ECP5 family SERDES and PCS architecture to implement serial links and protocol bridging.
  • Memory interface and buffering  Leverage on‑chip RAM and DDR support features for memory buffering, controllers, and interface logic implementations.
  • Embedded signal processing  Apply sysDSP slices and embedded memory for real‑time filtering, accumulation, and other DSP tasks within embedded systems.
  • Industrial control and I/O aggregation  Combine programmable I/O and abundant logic resources to implement motor control, sensor aggregation, or custom I/O bridging in industrial equipment.

Unique Advantages

  • Substantial on‑chip resources: Approximately 84,000 logic elements and ~3.8 Mbits of embedded RAM provide a balanced mix of logic capacity and memory for mid-range FPGA designs.
  • Flexible I/O and interface support: 118 programmable I/Os together with documented SERDES and I/O cell functionality enable diverse interface implementations without additional bridge ICs.
  • Industrial temperature rating: −40°C to 100°C operating range supports deployment in industrial environments.
  • Compact, surface‑mount package: 285-LFBGA (10×10 CSPBGA) package enables high‑density board layouts while preserving access to a large I/O count.
  • Controlled core power envelope: Narrow supply range (1.045 V to 1.155 V) simplifies power budgeting for the core domain.
  • Documented family features: Architecture-level capabilities such as sysCLOCK PLLs, sysDSP, sysMEM, programmable I/O, DDR support, and SERDES are specified in the ECP5 family data sheet for design planning and integration.

Why Choose LFE5UM-85F-8MG285I?

The LFE5UM-85F-8MG285I positions itself as a mid‑range ECP5 family FPGA offering a balance of logic density, embedded memory, and on‑chip interface resources in a compact industrial-grade package. Its documented family-level features—programmable I/O, clocking and PLL resources, DSP and memory blocks, and SERDES—allow designers to integrate complex digital functions and serial interfaces while keeping board footprint and BOM complexity under control.

This device is suitable for engineering teams building industrial embedded systems, communications adapters, and interface bridges that require reconfigurable logic, moderate on‑chip memory, and robust temperature performance. The combination of package density, I/O count, and family architecture support provides a scalable, verifiable platform for systems leveraging the ECP5 family data sheet guidance.

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