LFE5UM-85F-8BG756C

The LFE5UM-85F-8BG756C is a commercial‑grade ECP5 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It integrates a high density of programmable logic, embedded RAM, and extensive I/O resources in a compact 756‑FBGA package to address a wide range of commercial embedded designs.

Documented as part of the ECP5 family, the device provides on‑chip memory, DSP and SERDES/DDR support as described in the ECP5 family datasheet, making it suitable for designs that require programmable logic, memory, and flexible high‑speed I/O within a commercial temperature envelope.

Key Features

• Core Logic — 84,000 logic elements to implement complex programmable logic and control functions.
• Embedded Memory — Approximately 3.83 Mbits of on‑chip RAM for data buffering, LUTRAM, and state storage.
• I/O Density — 365 user I/O pins to support broad external interfacing and bus connectivity.
• Package & Mounting — 756‑FBGA (supplier package: 756‑CABGA, 27×27 mm) in a surface‑mount form factor for compact board designs.
• Power — Core supply specified from 1.045 V to 1.155 V to match system power rails and enable predictable power budgeting.
• Operating Range & Grade — Commercial grade operation with a specified operating temperature range of 0 °C to 85 °C.
• Family Architecture (per ECP5 datasheet) — Includes system clocking and PLL features, sysDSP slices, programmable I/O cells, DDR memory support and SERDES/PCS blocks as documented in the ECP5 family datasheet.
• Standards & Compliance — RoHS‑compliant for regulatory material requirements.

Typical Applications

• High‑speed serial interfaces — On‑chip SERDES and PCS blocks (ECP5 family) enable implementation of serial link endpoints and protocol bridging.
• Memory interface and buffering — DDR memory support and embedded RAM facilitate memory controllers, data buffering and packet handling.
• Signal processing and control — sysDSP slices and abundant logic resources support embedded DSP tasks, filtering, and real‑time control functions.
• Flexible I/O and protocol glue — Large I/O count and programmable I/O cells accommodate varied I/O standards and custom bus interfaces for commercial‑grade embedded products.

Unique Advantages

• High logic capacity: 84,000 logic elements provide room for complex state machines, custom accelerators, and consolidated logic that reduce external component count.
• Integrated memory resources: Approximately 3.83 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O in a compact package: 365 I/Os in a 756‑FBGA (27×27) package enable high‑density board designs while maintaining broad interfacing capability.
• Commercial operational profile: Specified for 0 °C to 85 °C and RoHS‑compliant, aligning with commercial product requirements and regulatory material expectations.
• Family‑level features: The ECP5 family datasheet documents clocking, DDR support, sysDSP, SERDES and programmable I/O functionality that designers can leverage for system integration.
• Predictable power domain: Narrow core supply range (1.045 V–1.155 V) supports stable power design and margin planning.

Why Choose LFE5UM-85F-8BG756C?

The LFE5UM-85F-8BG756C brings a balance of programmable logic capacity, embedded memory and substantial I/O in a single commercial‑grade FPGA package. It is well suited to engineers building compact, feature‑dense commercial embedded systems that require on‑chip DSP, DDR interfacing, and high‑speed serial capabilities as described in the ECP5 family documentation.

Choosing this device lets your design leverage the documented ECP5 family architecture and feature set while maintaining a clear hardware footprint (756‑FBGA surface‑mount) and defined operating conditions for predictable system integration and procurement.

Request a quote or submit a procurement inquiry to receive pricing and availability for LFE5UM-85F-8BG756C.