LFE5UM-85F-8BG554C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 259 3833856 84000 554-FBGA |
|---|---|
| Quantity | 425 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 554-CABGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 554-FBGA | Number of I/O | 259 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21000 | Number of Logic Elements/Cells | 84000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFE5UM-85F-8BG554C – ECP5 FPGA, 84,000 logic elements, ~3.83 Mbits RAM, 259 I/Os, 554‑FBGA
The LFE5UM-85F-8BG554C is a commercial‑grade ECP5 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It provides a mid‑range programmable fabric with 84,000 logic elements, approximately 3.83 Mbits of embedded memory, and 259 user I/Os for flexible system integration.
Designed for embedded systems, communications and interface‑centric designs, this surface‑mount 554‑FBGA device combines a compact package and low core‑voltage operation with family features such as on‑chip clock resources, DSP support, DDR memory interface capabilities and SERDES/PHY building blocks described in the ECP5 family datasheet.
Key Features
- Core logic — 84,000 logic elements (cells) providing programmable combinatorial and sequential resources for custom logic implementations.
- Embedded memory — Approximately 3.83 Mbits of on‑chip RAM suitable for buffers, FIFOs and local data storage.
- I/O density — 259 user I/Os for broad interfacing options and flexible board routing.
- Clocking and timing — Family‑level clock architecture with PLLs and clock distribution resources as described in the ECP5 datasheet to support multi‑clock designs.
- DSP and compute — sysDSP slice architecture included in the ECP5 family to support arithmetic and signal processing functions.
- SERDES and DDR support — Family documentation describes SERDES blocks, PHY sublayers and DDR memory support for high‑speed interface integration.
- Configuration and test — Device family features include enhanced configuration options and IEEE 1149.1‑compliant boundary scan capabilities for manufacturing and debug.
- Power and supply — Core supply operating range from 1.045 V to 1.155 V to match low‑voltage system designs.
- Package and mounting — 554‑FBGA (554‑CABGA, 23×23) surface‑mount package for compact board designs.
- Operating range and compliance — Commercial temperature range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Embedded systems — Implement control logic, custom peripherals and glue logic where moderate logic density and on‑chip memory are required.
- Communications and networking — Use the device’s SERDES/PHY and DDR support for interface bridging, packet processing and protocol adaptation.
- Video and imaging — Leverage DSP resources and abundant I/Os for pixel processing, buffering and I/O timing control.
- Test & measurement — Custom data paths, clocking schemes and boundary‑scan support enable instrument and measurement system integration.
Unique Advantages
- High logic and memory balance — 84,000 logic elements paired with ~3.83 Mbits of embedded RAM provides a balanced resource set for logic‑intensive applications with local memory needs.
- Flexible I/O capacity — 259 I/Os let you connect a wide range of peripherals and interfaces without external multiplexing.
- Compact, surface‑mount packaging — 554‑FBGA (23×23) simplifies placement in space‑constrained designs while maintaining high I/O count.
- Low‑voltage core operation — Narrow core supply window (1.045–1.155 V) supports designs targeting low‑power or modern supply domains.
- Family architecture features — ECP5 family capabilities such as PLLs, DSP slices, SERDES and DDR support give designers integrated building blocks for complex interfaces and signal processing.
- Standards and manufacturability — Boundary scan and documented configuration options in the ECP5 family streamline test and production workflows.
Why Choose LFE5UM-85F-8BG554C?
The LFE5UM-85F-8BG554C positions itself as a versatile mid‑range FPGA option within the ECP5 family, combining substantial logic capacity, embedded memory, and a high I/O count in a compact 554‑FBGA package. Its documented family features—clocking PLLs, DSP slices, SERDES/PHY blocks and DDR support—make it well suited to designers implementing interface‑rich, mixed‑signal and signal‑processing functions.
This device is appropriate for commercial temperature applications where a balanced mix of logic, memory and I/O is required. The packaged combination of resources and family architecture can reduce board complexity and consolidate discrete components, supporting scalable designs that leverage the ECP5 family feature set.
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