LFE5UM-85F-8BG554C

IC FPGA 259 I/O 554CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 259 3833856 84000 554-FBGA

Quantity 425 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package554-CABGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case554-FBGANumber of I/O259Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21000Number of Logic Elements/Cells84000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFE5UM-85F-8BG554C – ECP5 FPGA, 84,000 logic elements, ~3.83 Mbits RAM, 259 I/Os, 554‑FBGA

The LFE5UM-85F-8BG554C is a commercial‑grade ECP5 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It provides a mid‑range programmable fabric with 84,000 logic elements, approximately 3.83 Mbits of embedded memory, and 259 user I/Os for flexible system integration.

Designed for embedded systems, communications and interface‑centric designs, this surface‑mount 554‑FBGA device combines a compact package and low core‑voltage operation with family features such as on‑chip clock resources, DSP support, DDR memory interface capabilities and SERDES/PHY building blocks described in the ECP5 family datasheet.

Key Features

  • Core logic — 84,000 logic elements (cells) providing programmable combinatorial and sequential resources for custom logic implementations.
  • Embedded memory — Approximately 3.83 Mbits of on‑chip RAM suitable for buffers, FIFOs and local data storage.
  • I/O density — 259 user I/Os for broad interfacing options and flexible board routing.
  • Clocking and timing — Family‑level clock architecture with PLLs and clock distribution resources as described in the ECP5 datasheet to support multi‑clock designs.
  • DSP and compute — sysDSP slice architecture included in the ECP5 family to support arithmetic and signal processing functions.
  • SERDES and DDR support — Family documentation describes SERDES blocks, PHY sublayers and DDR memory support for high‑speed interface integration.
  • Configuration and test — Device family features include enhanced configuration options and IEEE 1149.1‑compliant boundary scan capabilities for manufacturing and debug.
  • Power and supply — Core supply operating range from 1.045 V to 1.155 V to match low‑voltage system designs.
  • Package and mounting — 554‑FBGA (554‑CABGA, 23×23) surface‑mount package for compact board designs.
  • Operating range and compliance — Commercial temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Embedded systems — Implement control logic, custom peripherals and glue logic where moderate logic density and on‑chip memory are required.
  • Communications and networking — Use the device’s SERDES/PHY and DDR support for interface bridging, packet processing and protocol adaptation.
  • Video and imaging — Leverage DSP resources and abundant I/Os for pixel processing, buffering and I/O timing control.
  • Test & measurement — Custom data paths, clocking schemes and boundary‑scan support enable instrument and measurement system integration.

Unique Advantages

  • High logic and memory balance — 84,000 logic elements paired with ~3.83 Mbits of embedded RAM provides a balanced resource set for logic‑intensive applications with local memory needs.
  • Flexible I/O capacity — 259 I/Os let you connect a wide range of peripherals and interfaces without external multiplexing.
  • Compact, surface‑mount packaging — 554‑FBGA (23×23) simplifies placement in space‑constrained designs while maintaining high I/O count.
  • Low‑voltage core operation — Narrow core supply window (1.045–1.155 V) supports designs targeting low‑power or modern supply domains.
  • Family architecture features — ECP5 family capabilities such as PLLs, DSP slices, SERDES and DDR support give designers integrated building blocks for complex interfaces and signal processing.
  • Standards and manufacturability — Boundary scan and documented configuration options in the ECP5 family streamline test and production workflows.

Why Choose LFE5UM-85F-8BG554C?

The LFE5UM-85F-8BG554C positions itself as a versatile mid‑range FPGA option within the ECP5 family, combining substantial logic capacity, embedded memory, and a high I/O count in a compact 554‑FBGA package. Its documented family features—clocking PLLs, DSP slices, SERDES/PHY blocks and DDR support—make it well suited to designers implementing interface‑rich, mixed‑signal and signal‑processing functions.

This device is appropriate for commercial temperature applications where a balanced mix of logic, memory and I/O is required. The packaged combination of resources and family architecture can reduce board complexity and consolidate discrete components, supporting scalable designs that leverage the ECP5 family feature set.

Request a quote or submit a pricing and availability inquiry for the LFE5UM-85F-8BG554C to receive lead‑time and procurement details.

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