LFE5UM-85F-8BG381C

IC FPGA 205 I/O 381CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 205 3833856 84000 381-FBGA

Quantity 1,427 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package381-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case381-FBGANumber of I/O205Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21000Number of Logic Elements/Cells84000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFE5UM-85F-8BG381C – ECP5 Field Programmable Gate Array (FPGA) IC 205 3833856 84000 381-FBGA

The LFE5UM-85F-8BG381C is a member of the Lattice ECP5 FPGA family, delivering a mid-range programmable logic fabric for embedded and system-level designs. It combines a large pool of logic elements with embedded memory and a rich set of programmable I/O and SERDES/PHY resources to address connectivity, memory-interface, and custom-acceleration requirements.

This commercial-grade device is offered in a 381-ball FBGA package with surface-mount mounting and operates across a 1.045–1.155 V supply range and a 0 °C to 85 °C ambient temperature window.

Key Features

  • Logic Capacity  Approximately 84,000 logic elements for implementing custom digital functions and control logic.
  • Embedded Memory  Approximately 3.8 Mbits of on-chip RAM (3,833,856 total RAM bits) for buffering, FIFOs, and local storage.
  • I/O Count  205 I/O pins to support multiple parallel and serial interfaces.
  • SERDES and PHY Blocks  On-chip SERDES and physical coding sublayer elements are included in the ECP5 family architecture for serial connectivity and high-speed link implementations.
  • Memory Interface Capability  Architectural support for DDR memory interfaces, including DQS grouping and calibrated delay control as described in the ECP5 family documentation.
  • DSP and Processing Blocks  sysDSP slice architecture in the ECP5 family provides dedicated resources for arithmetic and signal-processing tasks.
  • Clocking and PLL Resources  Integrated sysCLOCK PLL and clock-distribution network provide flexible clock management for synchronous designs.
  • Package and Mounting  381-FBGA package (supplier device package: 381-CABGA, 17×17) with surface-mount mounting for compact board integration.
  • Power and Temperature  Nominal supply range 1.045 V to 1.155 V; commercial operating temperature 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High-speed serial links and connectivity  Leverage the device’s SERDES and PCS blocks for implementing serialized interfaces and link-layer logic.
  • Memory interface and buffering  Use on-chip sysMEM blocks and DDR memory support for frame buffering, packet buffering, and memory controller logic.
  • Custom DSP and signal processing  Deploy sysDSP slices and the available logic elements to accelerate arithmetic and filtering functions in hardware.
  • Interface bridging and protocol conversion  Large I/O count and programmable I/O cells make the device suitable for bridging multiple parallel and serial buses and implementing protocol adapters.

Unique Advantages

  • Substantial logic and memory in a compact package:  About 84,000 logic elements and ~3.8 Mbits of embedded RAM provide a balance of capacity for complex control and data-path designs while fitting a 381-FBGA footprint.
  • Integrated SERDES and DDR features:  On-chip SERDES, PCS, and DDR-supporting blocks reduce external component count for memory and high-speed link implementations.
  • Flexible clock and DSP resources:  sysCLOCK PLLs and sysDSP slices enable deterministic timing architectures and on-chip acceleration of arithmetic workloads.
  • Design-ready I/O density:  205 I/O pins allow multiple peripheral interfaces and board-level connectivity without immediate need for external expanders.
  • Commercial-grade reliability:  Commercial operating range (0 °C to 85 °C) and RoHS compliance meet common electronics manufacturing and deployment requirements.

Why Choose LFE5UM-85F-8BG381C?

The LFE5UM-85F-8BG381C positions itself as a versatile mid-range FPGA option within the Lattice ECP5 family, blending sizable logic capacity, practical embedded memory, and integrated connectivity blocks in a compact 381-FBGA package. It is suited for designs that require on-chip buffering, serial links, and custom hardware acceleration while maintaining a commercial temperature profile.

Engineers targeting system-level integration and interface consolidation will find the device’s combination of logic elements, I/O density, DDR and SERDES-related features useful for reducing board-level complexity and streamlining BOM. As part of the ECP5 family from Lattice Semiconductor, this device aligns with a documented architectural model that includes clocking, memory, and DSP resources to support a broad range of embedded applications.

If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quote and lead-time information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up