LFE5UM-85F-8BG381C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 205 3833856 84000 381-FBGA |
|---|---|
| Quantity | 1,427 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 205 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21000 | Number of Logic Elements/Cells | 84000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFE5UM-85F-8BG381C – ECP5 Field Programmable Gate Array (FPGA) IC 205 3833856 84000 381-FBGA
The LFE5UM-85F-8BG381C is a member of the Lattice ECP5 FPGA family, delivering a mid-range programmable logic fabric for embedded and system-level designs. It combines a large pool of logic elements with embedded memory and a rich set of programmable I/O and SERDES/PHY resources to address connectivity, memory-interface, and custom-acceleration requirements.
This commercial-grade device is offered in a 381-ball FBGA package with surface-mount mounting and operates across a 1.045–1.155 V supply range and a 0 °C to 85 °C ambient temperature window.
Key Features
- Logic Capacity Approximately 84,000 logic elements for implementing custom digital functions and control logic.
- Embedded Memory Approximately 3.8 Mbits of on-chip RAM (3,833,856 total RAM bits) for buffering, FIFOs, and local storage.
- I/O Count 205 I/O pins to support multiple parallel and serial interfaces.
- SERDES and PHY Blocks On-chip SERDES and physical coding sublayer elements are included in the ECP5 family architecture for serial connectivity and high-speed link implementations.
- Memory Interface Capability Architectural support for DDR memory interfaces, including DQS grouping and calibrated delay control as described in the ECP5 family documentation.
- DSP and Processing Blocks sysDSP slice architecture in the ECP5 family provides dedicated resources for arithmetic and signal-processing tasks.
- Clocking and PLL Resources Integrated sysCLOCK PLL and clock-distribution network provide flexible clock management for synchronous designs.
- Package and Mounting 381-FBGA package (supplier device package: 381-CABGA, 17×17) with surface-mount mounting for compact board integration.
- Power and Temperature Nominal supply range 1.045 V to 1.155 V; commercial operating temperature 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- High-speed serial links and connectivity Leverage the device’s SERDES and PCS blocks for implementing serialized interfaces and link-layer logic.
- Memory interface and buffering Use on-chip sysMEM blocks and DDR memory support for frame buffering, packet buffering, and memory controller logic.
- Custom DSP and signal processing Deploy sysDSP slices and the available logic elements to accelerate arithmetic and filtering functions in hardware.
- Interface bridging and protocol conversion Large I/O count and programmable I/O cells make the device suitable for bridging multiple parallel and serial buses and implementing protocol adapters.
Unique Advantages
- Substantial logic and memory in a compact package: About 84,000 logic elements and ~3.8 Mbits of embedded RAM provide a balance of capacity for complex control and data-path designs while fitting a 381-FBGA footprint.
- Integrated SERDES and DDR features: On-chip SERDES, PCS, and DDR-supporting blocks reduce external component count for memory and high-speed link implementations.
- Flexible clock and DSP resources: sysCLOCK PLLs and sysDSP slices enable deterministic timing architectures and on-chip acceleration of arithmetic workloads.
- Design-ready I/O density: 205 I/O pins allow multiple peripheral interfaces and board-level connectivity without immediate need for external expanders.
- Commercial-grade reliability: Commercial operating range (0 °C to 85 °C) and RoHS compliance meet common electronics manufacturing and deployment requirements.
Why Choose LFE5UM-85F-8BG381C?
The LFE5UM-85F-8BG381C positions itself as a versatile mid-range FPGA option within the Lattice ECP5 family, blending sizable logic capacity, practical embedded memory, and integrated connectivity blocks in a compact 381-FBGA package. It is suited for designs that require on-chip buffering, serial links, and custom hardware acceleration while maintaining a commercial temperature profile.
Engineers targeting system-level integration and interface consolidation will find the device’s combination of logic elements, I/O density, DDR and SERDES-related features useful for reducing board-level complexity and streamlining BOM. As part of the ECP5 family from Lattice Semiconductor, this device aligns with a documented architectural model that includes clocking, memory, and DSP resources to support a broad range of embedded applications.
If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quote and lead-time information.