LFE5UM-85F-7BG756C

The LFE5UM-85F-7BG756C is an ECP5 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It integrates 21,000 configurable logic blocks (CLBs) delivering 84,000 logic elements, approximately 3.8 Mbits of embedded memory, and 365 general-purpose I/Os in a 756-ball FBGA package.

Designed for commercial-grade applications, the device ships in a 756-CABGA (27×27) package, supports surface-mount assembly, and operates from a core supply range of 1.045 V to 1.155 V with an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity — 21,000 CLBs providing 84,000 logic elements for user-configurable digital logic implementation.
• Embedded Memory — Approximately 3.8 Mbits of on-chip RAM to support buffering, FIFOs, and working storage for custom logic.
• Rich I/O — 365 I/O pins for flexible interfacing with peripherals, memory, and external logic.
• Package and Mounting — 756-FBGA (supplier package: 756-CABGA, 27×27) optimized for space-efficient surface-mount PCB designs.
• Power — Narrow core supply range (1.045 V to 1.155 V) to match regulated power rails and simplify power sequencing.
• Operating Grade — Commercial temperature range of 0 °C to 85 °C suitable for standard commercial applications.
• Standards and Manufacturing — RoHS-compliant and supplied in a surface-mount package for modern assembly workflows.
• ECP5 Family Architecture — Family-level architecture elements described in the datasheet include programmable I/O cells, clocking structures (including PLL), sysDSP slices, DDR memory support, SERDES and physical coding sublayer blocks, and enhanced configuration options.

Typical Applications

• DDR Memory Interfaces — Devices with DDR memory support and DQS grouping features enable implementation of external DDR memory controllers and buffering logic.
• High‑Speed Serial Links — Family-level SERDES and physical coding sublayer capabilities support designs requiring serial transceivers and protocol bridging.
• On‑chip DSP and Acceleration — sysDSP slice architecture and embedded RAM provide building blocks for signal processing, data path acceleration, and custom arithmetic functions.

Unique Advantages

• High integration density: 84,000 logic elements and about 3.8 Mbits of embedded memory reduce external logic and memory needs, simplifying BOM and board area.
• Extensive I/O count: 365 I/Os allow broad connectivity options for peripherals, buses, and multiple external devices without external expander chips.
• Compact package: 756-CABGA (27×27) provides a small footprint for designs constrained by PCB space while maintaining a high ball count for routing flexibility.
• Configurable architecture: ECP5 family features such as programmable I/O cells, PLL-based clocking, DDR support, and sysDSP slices enable a range of implementation styles from I/O-centric glue logic to signal processing accelerators.
• Manufacturing-ready: Surface-mount packaging and RoHS compliance support modern PCB assembly and environmental requirements.
• Commercial temperature rating: Rated for 0 °C to 85 °C to meet standard commercial application environments.

Why Choose LFE5UM-85F-7BG756C?

The LFE5UM-85F-7BG756C delivers a balanced combination of logic density, embedded memory, and a high I/O count in a compact 756-ball FBGA package. As a member of the ECP5 family, it benefits from an architecture that includes programmable I/O, flexible clocking, DDR memory support, sysDSP capabilities, and SERDES building blocks—features documented in the family datasheet.

This device is well suited to commercial designs that require reconfigurable logic with significant on-chip resources and broad external connectivity, offering a scalable platform for applications that need mid-range logic capacity and embedded memory in a manufacturable package.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the LFE5UM-85F-7BG756C. Our team can assist with volume pricing and supply options tailored to your project timeline.