LFE5UM-85F-7BG554C

The LFE5UM-85F-7BG554C is a commercial-grade ECP5 field programmable gate array (FPGA) from Lattice Semiconductor. It provides 84,000 logic elements and approximately 3.83 Mbits of embedded RAM in a 554-ball FBGA package tailored for surface-mount PCB assembly.

With 259 user I/O signals, a defined supply voltage window of 1.045 V to 1.155 V, and an operating temperature range of 0 °C to 85 °C, this device is suited for mid-density programmable logic applications that require significant I/O capacity and on-chip memory within a compact package footprint.

Key Features

• Core Logic  Approximately 84,000 logic elements provide mid-range FPGA capacity for custom logic, glue-logic, and acceleration functions.
• Embedded Memory  Approximately 3.83 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for processing pipelines.
• User I/O  259 available I/O pins for broad peripheral and system interfacing without external expanders.
• Power  Specified supply voltage range: 1.045 V to 1.155 V, enabling deterministic power planning for system designs.
• Package & Mounting  554-FBGA (554-CABGA, 23×23) in a surface-mount form factor for dense board-level integration.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.
• Family-Level Architecture  ECP5 family datasheet documents features such as DDR memory support, SERDES and PCS blocks, DSP slices (sysDSP), programmable I/O cells, and enhanced clocking—available across the ECP5 series.

Typical Applications

• Communications & Networking  Use the device’s numerous I/O and family SERDES/PCS capabilities to implement packet framing, protocol bridging, and interface adaptation in commercial networking equipment.
• Video & Imaging  Leverage the device’s logic density and on-chip RAM for video pre-processing, frame buffering, and custom image pipelines.
• Industrial Control & Automation  Deploy the FPGA for sensor aggregation, motor and motion control logic, and real-time I/O handling within the commercial temperature range.
• Embedded Systems & Prototyping  Mid-density logic and broad I/O count make the part suitable for custom embedded logic, interface consolidation, and rapid prototyping of system functions.

Unique Advantages

• Scalable mid-density FPGA:  Approximately 84,000 logic elements offer a balance between capacity and cost for many commercial designs.
• Significant on-chip memory:  Around 3.83 Mbits of embedded RAM reduces external memory needs for buffering and local data storage.
• High I/O count:  259 I/Os simplify system integration by enabling direct connections to sensors, peripherals, and buses.
• Compact, production-ready package:  554-FBGA (23×23) surface-mount package supports dense board layouts while maintaining manufacturability.
• Defined power and thermal envelope:  Specified supply range and commercial operating temperature support predictable system-level power and thermal design.
• Backed by ECP5 family architecture:  Family-level features such as DDR support, DSP resources, programmable I/O, and SERDES blocks (documented in the ECP5 datasheet) give designers a clear reference for system capabilities.

Why Choose LFE5UM-85F-7BG554C?

The LFE5UM-85F-7BG554C positions itself as a commercially graded, mid-density FPGA option offering substantial logic capacity, embedded RAM, and a high I/O count in a compact 554-FBGA package. It is appropriate for designers who need a balance of on-chip resources and board-level integration without moving to higher-density product tiers.

This device is well suited to engineering teams implementing interface-rich systems, embedded processing blocks, or custom logic pipelines that benefit from the documented ECP5 family architecture. Its defined electrical and temperature specifications support predictable integration into commercial applications and production flows.

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