LFE5UM-85F-6MG285C

The LFE5UM-85F-6MG285C is an ECP5 family FPGA from Lattice Semiconductor designed for commercial embedded applications that require programmable logic, on‑chip memory, and flexible I/O. The device combines 84,000 logic elements with approximately 3.83 Mbits of embedded RAM and 118 user I/Os in a surface‑mount 285‑LFBGA (285‑CSFBGA, 10×10) package.

On‑chip features documented for the ECP5 family include integrated clocking (PLLs), SERDES and physical coding sublayer support, DDR memory support, programmable I/O cells, and DSP‑oriented slices, enabling a range of communications, memory interface, and signal‑processing implementations while operating from a low‑voltage core rail and a commercial temperature grade.

Key Features

• Logic Capacity — 84,000 logic elements provide significant programmable logic resources for complex combinational and sequential designs.
• Embedded Memory — Approximately 3.83 Mbits of on‑chip RAM for data buffering, FIFOs, and local storage.
• I/O and Interfaces — 118 user I/Os with programmable I/O cell architecture and documented support for DDR memory interfaces and SERDES/PCS functionality.
• Clocking and Timing — Integrated system clocking features including PLLs and a structured clock distribution network as described in the ECP5 family datasheet.
• DSP and Processing Blocks — Family documentation describes sysDSP slices and DSP‑oriented resources for arithmetic and signal processing tasks.
• Device Configuration and Test — ECP5 family data sheet includes enhanced configuration options, on‑chip oscillator, and IEEE 1149.1 boundary‑scan testability.
• Power and Voltage — Core voltage supply documented at 1.045 V to 1.155 V.
• Package & Mounting — 285‑LFBGA (285‑CSFBGA, 10×10) package, surface‑mount mounting type suitable for compact board designs.
• Commercial Temperature Grade — Operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Embedded control and glue logic — Use the programmable logic and abundant I/O to implement custom control, protocol bridging, and board‑level glue functions in commercial systems.
• Memory interface and buffering — On‑chip RAM and documented DDR memory support make the device suitable for designs requiring local buffering and memory arbitration.
• Communications and SERDES applications — SERDES and PCS features, together with programmable I/O, support high‑speed serial client interfaces and protocol handling.
• Signal processing — sysDSP slices and embedded memory enable implementations of arithmetic‑heavy or streaming signal‑processing blocks.

Unique Advantages

• Substantial logic and memory density: 84,000 logic elements and ~3.83 Mbits of embedded RAM provide room for complex designs without external glue logic.
• Flexible I/O and interface support: 118 user I/Os with programmable I/O cells, DDR memory support, and SERDES/PCS capabilities simplify integration of diverse interfaces.
• Integrated clock and system features: On‑chip PLLs and a comprehensive clock distribution architecture reduce dependence on external timing components.
• Compact surface‑mount package: The 285‑LFBGA (285‑CSFBGA, 10×10) package supports high‑density PCB designs while keeping board footprint manageable.
• Low‑voltage core operation: A documented core voltage range of 1.045 V to 1.155 V supports modern low‑power system designs.
• Commercial grade and RoHS compliant: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.

Why Choose LFE5UM-85F-6MG285C?

The LFE5UM-85F-6MG285C delivers a balanced combination of programmable logic density, embedded RAM, and flexible I/O in a compact surface‑mount package, making it well suited to commercial embedded applications that demand integrated logic, memory, and interface capabilities. Family‑level features documented in the datasheet—such as PLLs, SERDES, DDR support, and DSP slices—allow designers to implement communication, memory interface, and signal processing functions within a single device.

This part is appropriate for development teams and procurement engineers seeking a commercial‑grade FPGA with a defined operating temperature range and RoHS compliance, offering a focused set of on‑chip resources to reduce external component count and simplify board‑level integration.

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